Data Sheet

1.3 MCU and Advanced Features 1 OVERVIEW

1.3 MCU and Advanced Features

1.3.1 CPU and Memory

• Xtensa

Dual-Core 32-bit LX6 microprocessors, up to 600 DMIPS

• 448 KByte ROM

• 520 KByte SRAM

• 16 KByte SRAM in RTC

• QSPI Flash/SRAM, up to 4 x 16 MBytes

• Power supply: 2.2 V to 3.6 V

1.3.2 Clocks and Timers

• Internal 8 MHz oscillator with calibration

• Internal RC oscillator with calibration

• External 2 MHz to 40 MHz crystal oscillator

• External 32 kHz crystal oscillator for RTC with calibration

• Two timer groups, including 2 x 64-bit timers and 1 x main watchdog in each group

• RTC timer with sub-second accuracy

• RTC watchdog

1.3.3 Advanced Peripheral Interfaces

• 12-bit SAR ADC up to 18 channels

• 2 × 8-bit D/A converters

• 10 × touch sensors

• Temperature sensor

• 4 × SPI

• 2 × I2S

• 2 × I2C

• 3 × UART

• 1 host (SD/eMMC/SDIO)

• 1 slave (SDIO/SPI)

• Ethernet MAC interface with dedicated DMA and IEEE 1588 support

• CAN 2.0

• IR (TX/RX)

• Motor PWM

• LED PWM up to 16 channels

• Hall sensor

• Ultra low power analog pre-amplifier

Espressif Systems 3 http://www.espressif.com