Datasheet

Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device:
ATECC608A: Cryptographic Co-processor with Secure Hardware-based Key
Storage
Package Options SSH 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC
SOIC)
MAH 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin
Dual Flat NoLead Package (UDFN)
W07
(3)
Die-on-Tape and Reel. Available to qualified customers only. Please
contact your local Microchip Sales Office for more details on this
packaging option.
I/O Type CZ Single Wire Interface
DA I
2
C Interface
Tape and Reel Options B Tube
T Large Reel (Size varies by package type)
S Small Reel (Only available for MAH)
Examples:
• ATECC608A-SSHCZ-T: 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC
SOIC), Single-Wire, Tape and Reel, 4,000 per Reel
• ATECC608A-SSHCZ-B: 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC
SOIC), Single-Wire, Tube, 100 per Tube
• ATECC608A-SSHDA-T: 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC
SOIC), I
2
C, Tape and Reel, 4,000 per Reel
• ATECC608A-SSHDA-B: 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC
SOIC), I
2
C, Tube, 100 per Tube
• ATECC608A-MAHCZ-T: 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual
Flat NoLead Package (UDFN), Single-Wire, Tape and Reel, 15,000 per Reel
• ATECC608A-MAHDA-T: 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual
Flat NoLead Package (UDFN), I
2
C, Tape and Reel, 15,000 per Reel
• ATECC608A-MAHCZ-S: 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual
Flat NoLead Package (UDFN), Single-Wire, Tape and Reel, 3,000 per Reel
• ATECC608A-MAHDA-S: 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual
Flat NoLead Package (UDFN), I
2
C, Tape and Reel, 3,000 per Reel
ATECC608A
© 2018 Microchip Technology Inc.
Datasheet Summary
DS40001977B-page 25