Datasheet
Table Of Contents
- Features
- Applications
- Pin Configuration and Pinouts
- Table of Contents
- 1. Introduction
- 2. Electrical Characteristics
- 3. Compatibility
- 4. Package Marking Information
- 5. Package Drawings
- 6. Revision History
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Product Identification System
- Microchip Devices Code Protection Feature
- Legal Notice
- Trademarks
- Quality Management System Certified by DNV
- Worldwide Sales and Service
5.2 8-pad UDFN
B
A
0.10 C
0.10 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
1 2
N
2X
TOP VIEW
SIDE VIEW
NOTE 1
1 2
N
0.10 C A B
0.10 C A B
0.10
C
0.08 C
Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 1 of 2
2X
8X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
© 2017 Microchip Technology Inc.
D
E
D2
E2
K
L
8X b
e
e
2
0.10 C A B
0.05 C
A
(A3)
A1
BOTTOM VIEW
ATECC608A
Package Drawings
© 2018 Microchip Technology Inc.
Datasheet Summary
DS40001977B-page 20