Datasheet
Table Of Contents
- Features
- Applications
- Pin Configuration and Pinouts
- Table of Contents
- 1. Introduction
- 2. Electrical Characteristics
- 3. Compatibility
- 4. Package Marking Information
- 5. Package Drawings
- 6. Revision History
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Product Identification System
- Microchip Devices Code Protection Feature
- Legal Notice
- Trademarks
- Quality Management System Certified by DNV
- Worldwide Sales and Service
RECOMMENDED LAND PATTERN
Microchip Technology Drawing C04-2057-M6B Rev B
8-Lead Plastic Small Outline - Narrow, 3.90 mm (.150 In.) Body [SOIC]
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2017 Microchip Technology Inc.
R
Dimension Limits
Units
CContact Pad Spacing
Contact Pitch
MILLIMETERS
1.27 BSC
MIN
E
MAX
5.40
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
1.55
0.60
NOM
E
X1
C
Y1
SILK SCREEN
Atmel Legacy
ATECC608A
Package Drawings
© 2018 Microchip Technology Inc.
Datasheet Summary
DS40001977B-page 19