Datasheet

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Parameter Symbol Min. Max. Units
Stop Setup Time t
SU.STO
250 ns
Data In Setup Time t
SU.DAT
100 ns
Data In Hold Time t
HD.DAT
0 ns
Input Rise Time
(1)
t
R
300 ns
Input Fall Time
(1)
t
F
100 ns
Clock Low to Data Out Valid t
AA
50 550 ns
Data Out Hold Time t
DH
50 ns
SMBus Timeout Delay t
TIMEOUT
25 75 ms
Time bus must be free before a new transmission can start
(1)
t
BUF
500 ns
Note: 
1. Values are based on characterization and are not tested.
2. AC measurement conditions:
R
L
(connects between SDA and V
CC
): 1.2 kΩ (for V
CC
= +2.0V to +5.0V)
Input pulse voltages: 0.3V
CC
to 0.7V
CC
Input rise and fall times: ≤ 50 ns
Input and output timing reference voltage: 0.5V
CC
2.4 DC Parameters: All I/O Interfaces
Table 2-5. DC Parameters on All I/O Interfaces
Parameter
Symbol Min. Typ. Max. Unit Conditions
Ambient Operating
Temperature
T
A
-40 +85 °C
Power Supply
Voltage
V
CC
2.0 5.5 V
Active Power
Supply Current
I
CC
2 3 mA Waiting for I/O during I/O transfers or execution of non-
ECC commands. Independent of Clock Divider value.
14 mA During ECC command execution. Clock divider = 0x0
6 mA During ECC command execution. Clock divider = 0x5
3 mA During ECC command execution. Clock divider = 0xD
Idle Power Supply
Current
I
IDLE
800 µA When device is in idle mode,
V
SDA
and V
SCL
< 0.4V or > V
CC
– 0.4
Sleep Current I
SLEEP
30 150 nA When device is in sleep mode, V
CC
≤ 3.6V,
V
SDA
and V
SCL
< 0.4V or > V
CC
– 0.4, T
A
≤ 55°C
2 µA When device is in sleep mode.
Over full V
CC
and temperature range.
ATECC608A
Electrical Characteristics
© 2018 Microchip Technology Inc.
Datasheet Summary
DS40001977B-page 10