Datasheet

Table Of Contents
DocID022152 Rev 8 165/202
STM32F405xx, STM32F407xx Package information
Figure 76. WLCSP90 - 4.223 x 3.969 mm, 0.400 mm pitch wafer level chip scale
recommended footprint
Table 90. WLCSP90 - 4.223 x 3.969 mm, 0.400 mm pitch wafer level chip scale
package mechanical data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Min Typ Max Min Typ Max
A 0.540 0.570 0.600 0.0213 0.0224 0.0236
A1 - 0.190 - - 0.0075 -
A2 - 0.380 - - 0.0150 -
A3
(2)
2. Back side coating.
- 0.025 - - 0.0010 -
b
(3)
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
0.240 0.270 0.300 0.0094 0.0106 0.0118
D 4.188 4.223 4.258 0.1649 0.1663 0.1676
E 3.934 3.969 4.004 0.1549 0.1563 0.1576
e - 0.400 - - 0.0157 -
e1 - 3.600 - - 0.1417 -
e2 - 3.200 - - 0.1260 -
F - 0.3115 - - 0.0123 -
G - 0.3845 - - 0.0151 -
aaa - 0.100 - - 0.0039 -
bbb - 0.100 - - 0.0039 -
ccc - 0.100 - - 0.0039 -
ddd - 0.050 - - 0.0020 -
eee - 0.050 - - 0.0020 -
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