Datasheet

DocID022152 Rev 8 99/202
STM32F405xx, STM32F407xx Electrical characteristics
5.3.8 External clock source characteristics
High-speed external user clock generated from an external source
The characteristics given in Table 30 result from tests performed using an high-speed
external clock source, and under ambient temperature and supply voltage conditions
summarized in
Table 14.
Table 29. Low-power mode wakeup timings
Symbol Parameter Min
(1)
Typ
(1)
Max
(1)
Unit
t
WUSLEEP
(2)
Wakeup from Sleep mode - 5 -
CPU
clock
cycle
t
WUSTOP
(2)
Wakeup from Stop mode (regulator in Run mode and
Flash memory in Stop mode)
-13-
µs
Wakeup from Stop mode (regulator in low-power mode
and Flash memory in Stop mode)
-1740
Wakeup from Stop mode (regulator in Run mode and
Flash memory in Deep power-down mode)
-105-
Wakeup from Stop mode (regulator in low-power mode
and Flash memory in Deep power-down mode)
-110-
t
WUSTDBY
(2)(3)
Wakeup from Standby mode 260 375 480 µs
1. Guaranteed by characterization.
2. The wakeup times are measured from the wakeup event to the point in which the application code reads the first instruction.
3. t
WUSTDBY
minimum and maximum values are given at 105 °C and –45 °C, respectively.
Table 30. High-speed external user clock characteristics
Symbol Parameter Conditions Min Typ Max Unit
f
HSE_ext
External user clock source
frequency
(1)
-
1-50MHz
V
HSEH
OSC_IN input pin high level voltage 0.7V
DD
-V
DD
V
V
HSEL
OSC_IN input pin low level voltage V
SS
-0.3V
DD
t
w(HSE)
t
w(HSE)
OSC_IN high or low time
(1)
1. Guaranteed by design.
5--
ns
t
r(HSE)
t
f(HSE)
OSC_IN rise or fall time
(1)
--10
C
in(HSE)
OSC_IN input capacitance
(1)
--5-pF
DuCy
(HSE)
Duty cycle - 45 - 55 %
I
L
OSC_IN Input leakage current V
SS
≤ V
IN
≤ V
DD
--±1µA