Datasheet

QuickLogic EOS S3 Ultra Low Power multicore MCU datasheet - Version 3.3d 27-129
© 2020 QuickLogic Corporation
www.quicklogic.com 7
System DMA .......................................................................................................................... 86
9.2.1. Functional Description ......................................................................................................................... 86
9.2.2. SDMA Configurations .......................................................................................................................... 88
Analog-to-Digital Converter .................................................................................................... 88
9.3.1. Overview.............................................................................................................................................. 88
9.3.2. Functional Description ......................................................................................................................... 89
9.3.3. Electrical Characteristics ..................................................................................................................... 89
9.3.4. PCB Layout Recommendations .......................................................................................................... 89
9.3.5. Example Application ............................................................................................................................ 89
Universal Asynchronous Receiver Transmitter (UART) ......................................................... 90
Timer and Counters ............................................................................................................... 91
9.5.1. 1 ms Event Counter ............................................................................................................................. 92
9.5.2. Error Correction for 1 mS Event Counter ............................................................................................ 92
9.5.3. Timeout Event Counter ....................................................................................................................... 93
9.5.4. 30-Bit Counter ..................................................................................................................................... 93
9.5.5. Time Stamp Counters ......................................................................................................................... 93
9.5.6. PMU and FFE Wakeup ....................................................................................................................... 93
10. Device Characteristics ................................................................................................ 95
Pinout and Pin Description ................................................................................................... 95
I/O State .............................................................................................................................. 99
11. Electrical Specifications ............................................................................................ 102
DC Characteristics ............................................................................................................. 102
Output Drive Current .......................................................................................................... 104
Clock and Oscillator Characteristics................................................................................... 105
Output Rise/Fall Time ........................................................................................................ 105
11.4.1. Output Rise/Fall Time (VCCIO = 1.8V) ........................................................................................... 105
11.4.2. Output Rise/Fall Time (VCCIO = 2.5V) ........................................................................................... 106
11.4.3. Output Rise/Fall Time (VCCIO = 3.3V) ........................................................................................... 107
Power Consumption .......................................................................................................... 107
12. Application Examples ................................................................................................ 109
Smartphone or High-Level O/S Wearable Design .............................................................. 109
Real-Time Operating System Wearable Design ................................................................. 109
13. Package Information .................................................................................................. 111
42-Ball WLCSP Package Drawing ..................................................................................... 111
64-Ball BGA Package Drawing .......................................................................................... 112
64-Pin QFN Package Drawing ........................................................................................... 113
14. Soldering Information ................................................................................................ 114
Reflow Profile .................................................................................................................... 114
Package Thermal Characteristics ...................................................................................... 115