Datasheet

QuickLogic EOS S3 Ultra Low Power multicore MCU datasheet - Version 3.3d 27-129
© 2020 QuickLogic Corporation www.quicklogic.com 115
Package Thermal Characteristics
The EOS S3 Ultra Low Power multicore MCU platform is available for Commercial (–20 °C to 85 °C) junction temperature
ranges.
Thermal Resistance Equations:
θ
JC
= (T
J
- T
C
)/P
θ
JA
= (TJ - TA)/P
P
MAX
= (T
JMAX
- T
AMAX
)/ θ
JA
Parameter Description:
θ
JC
: Junction-to-case thermal resistance
θ
JA
: Junction-to-ambient thermal resistance T
J
: Junction temperature
T
A
: Ambient temperature
P: Power dissipated by the device while operating P
MAX
: The maximum power dissipation for the device T
JMAX
: Maximum
junction temperature
T
AMAX
: Maximum ambient temperature
NOTE: The maximum junction temperature (T
JMAX
) is 125°C. To calculate the maximum power dissipation for a device
package, look up θ
JA
from Table 43, pick an appropriate T
AMAX
and use: P
MAX
= (125°C - T
AMAX
)/ θ
JA.
Table 52: Package Thermal Characteristics
Package Description
θ
JC
(° C/W)
Air Flow
(m/sec)
θ
JA
(° C/W)
Package Type Pin
Count
WLCSP 42 5.3 0.0 71.5
0.5 66.4
1.0 65.0
1.5 64.1
BGA 64 36.6 0.0 69.9
0.5 67.6
1.0 66.7
1.5 66.1