Datasheet

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14. Soldering Information
Reflow Profile
QuickLogic follows IPC/JEDEC J-STD-020 specification for lead-free devices. The following figure shows the Pb-free
component preconditioning reflow profile.
Figure 63: Pb-Free Component Preconditioning Reflow Profile
The following table lists the Pb-free component preconditioning reflow profile.
Table 51: Pb-Free Component Preconditioning Reflow Profile
a, b
Profile Feature Profile Conditions
Average ramp-up rate (Ts
max
) to Tp) 3 °C per sec. max.
Preheat:
Temperature Min (Ts
min
)
Temperature Max (Ts
max
)
Time (Ts
min
to Ts
max
) (ts)
150 °C
200 °C
60 sec. to 120 sec.
Time maintained above:
Temperature (T
L
)
Time (t
L
)
217 °C
60 sec. to 150 sec.
Peak Temperature (Tp) 260 °C
Time within 5°C of actual peak temperature (260°C) 20 sec. to 40 sec.
Ramp-down rate 6 °C per sec. max.
Time 25°C to peak temperature 8 min. max.
a. The above conditions are used for component qualifications. This should not be interpreted as the recommended
profile for board mounting. Customers should optimize their board mounting reflow profile based on their specific
conditions such as board design, solder paste, etc.
b. All temperatures are measured on the package body surface.