User Manual

Apollo3 Blue Datasheet
DS-A3-0p9p1 Page 797 of 909 2019 Ambiq Micro, Inc.
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22. Package Mechanical Information
22.1 CSP Package
Figure 103. CSP Package Drawing
Notes:
1. Dimensionbismeasuredatthemaximumsolder
bumpdiameter,paralleltoprimarydatumC.
2. ThispodisfordeviceApollo3withoutbackside
coating.
3. eF isthedistancebetweenthecenterlinesofrow
CandrowDofballs.
4. eG istheverticaloffsetfromcenterofpackageto
centerofD5ball.

5. eH isthehorizontaloffsetfromcenterofpackage
tocenterofD5ball.
6. Inthebottomview,theD5ballcenterisaboveand
totheleftofthecenterofpackage,makingthe
overallD5offset fromthecenterofpackage
towardthetop‐leftquadrant(A9corner)ofthe
package.