MCP73831T Datasheet

© 2008 Microchip Technology Inc. DS21984E-page 19
MCP73831/2
APPENDIX A: REVISION HISTORY
Revision E (September 2008)
The following is the list of modifications:
1. Package Types: Changed DFN pinout diagram.
2. 1.0 “Electrical Characteristics”: Changed
“Charge Impedance Range from 20 kΩ to
67 kΩ.
3. 1.0 “Electrical Characteristics”: Misc. Format-
ting changes.
4. Section 2.0 “Typical Performance Curves”:
Updated Figure 2-4.
5. Section 3.0 “Pin Description”: Added
Exposed Pad pin to table and added
Section 3.6 “Exposed Thermal Pad (EP)”.
6. Updated Appendix A: “Revision History”
7. Added Land Patttern Package Outline Drawing
for 2x3 DFN package.
8. Pagination fixes throughout document per
Marcom Standards.
Revision D (April 2008)
The following is the list of modifications:
1. Changed Charge Termination Current Ratio to
8.5% minimum and 11.5% maximum.
Revision C (October 2007)
The following is the list of modifications:
1. Numerous edits throughout document.
2. Added note to Temperature Specifications table.
3. Updated Figure 2-4.
Revision B (March 2006)
The following is the list of modifications:
1. Added MCP73832 through document.
Revision A (November 2005)
• Original Release of this Document.