ADXL335 Datasheet

ADXL335
Rev. A | Page 14 of 16
OUTLINE DIMENSIONS
051909-A
1
0.65
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
2.55
2.40 SQ
2.25
0.55
0.50
0.45
SEATING
PLANE
1.50
1.45
1.40
0.05 MAX
0.02 NOM
0.15 REF
COPLANARITY
0.08
0.15 MAX
PIN 1
INDICATOR
4.15
4.00 SQ
3.85
0.35
0.30
0.25
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 27. 16-Lead Lead Frame Chip Scale Package [LFCSP_LQ]
4 mm × 4 mm Body, 1.45 mm Thick Quad
(CP-16-14)
Dimensions shown in millimeters
ORDERING GUIDE
Model Measurement Range Specified Voltage Temperature Range Package Description Package Option
ADXL335BCPZ
1
±3 g 3 V −40°C to +85°C 16-Lead LFCSP_LQ CP-16-14
ADXL335BCPZ–RL
1
±3 g 3 V −40°C to +85°C 16-Lead LFCSP_LQ CP-16-14
ADXL335BCPZ–RL7
1
±3 g 3 V −40°C to +85°C 16-Lead LFCSP_LQ CP-16-14
EVAL-ADXL335Z
1
Evaluation Board
1
Z = RoHS Compliant Part.