ADXL335 Datasheet

ADXL335
Rev. A | Page 13 of 16
LAYOUT AND DESIGN RECOMMENDATIONS
The recommended soldering profile is shown in Figure 25 followed by a description of the profile features in Table 6. The recommended
PCB layout or solder land drawing is shown in Figure 26.
07808-002
t
P
t
L
t 25°C TO PEAK
t
S
PREHEAT
CRITICAL ZONE
T
L
TO T
P
TEMPERATURE
TIME
RAMP-DOWN
RAMP-UP
T
SMIN
T
SMAX
T
P
T
L
Figure 25. Recommended Soldering Profile
Table 6. Recommended Soldering Profile
Profile Feature Sn63/Pb37 Pb-Free
Average Ramp Rate (T
L
to T
P
) 3°C/sec max 3°C/sec max
Preheat
Minimum Temperature (T
SMIN
) 100°C 150°C
Maximum Temperature (T
SMAX
) 150°C 200°C
Time (T
SMIN
to T
SMAX
)(t
S
) 60 sec to 120 sec 60 sec to 180 sec
T
SMAX
to T
L
Ramp-Up Rate 3°C/sec max 3°C/sec max
Time Maintained Above Liquidous (T
L
)
Liquidous Temperature (T
L
) 183°C 217°C
Time (t
L
) 60 sec to 150 sec 60 sec to 150 sec
Peak Temperature (T
P
) 240°C + 0°C/−5°C 260°C + 0°C/−5°C
Time Within 5°C of Actual Peak Temperature (t
P
) 10 sec to 30 sec 20 sec to 40 sec
Ramp-Down Rate 6°C/sec max 6°C/sec max
Time 25°C to Peak Temperature 6 minutes max 8 minutes max
EXPOSED PAD IS NOT
INTERNALLY CONNECTED
BUT SHOULD BE SOLDERED
FOR MECHANICAL INTEGRITY.
0.50
MAX
0.65 0.325
1.95
0.65
0.325
4
4
0.35
MAX
1.95
DIMENSIONS SHOWN IN MILLIMETERS
07808-004
Figure 26. Recommended PCB Layout