Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
NA555DR SOIC D 8 2500 367.0 367.0 35.0
NA555DR SOIC D 8 2500 340.5 338.1 20.6
NE555DR SOIC D 8 2500 364.0 364.0 27.0
NE555DR SOIC D 8 2500 340.5 338.1 20.6
NE555DR SOIC D 8 2500 367.0 367.0 35.0
NE555DR SOIC D 8 2500 333.2 345.9 28.6
NE555DRG4 SOIC D 8 2500 340.5 338.1 20.6
NE555DRG4 SOIC D 8 2500 367.0 367.0 35.0
NE555PWR TSSOP PW 8 2000 367.0 367.0 35.0
SA555DR SOIC D 8 2500 340.5 338.1 20.6
SA555DRG4 SOIC D 8 2500 340.5 338.1 20.6
SE555DR SOIC D 8 2500 350.0 350.0 43.0
SE555DRG4 SOIC D 8 2500 350.0 350.0 43.0
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jun-2019
Pack Materials-Page 2