Datasheet
Table Of Contents
- General Description
- Applications
- Features
- Functional Block Diagram
- Ordering Information
- Table of Contents
- Specifications
- Absolute Maximum Ratings
- Pin Configuration And Function Descriptions
- Typical Performance Characteristics
- Applications Information
- Supporting Documents
- PCB Design And Land Pattern Layout
- Handling Instructions
- Outline Dimensions
- Compliance Declaration Disclaimer
ICS-40180
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
• Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
• Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
• Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 1 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Page 11 of 14
Document Number: DS-000021
Revision: 1.2