Datasheet
4
TCA9548A
SCPS207F –MAY 2012–REVISED NOVEMBER 2016
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage –0.5 7 V
V
I
Input voltage
(2)
–0.5 7 V
I
I
Input current –20 20 mA
I
O
Output current –25 mA
I
CC
Supply current –100 100 mA
T
stg
Storage temperature –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1000
6.3 Recommended Operating Conditions
MIN MAX UNIT
V
CC
Supply voltage 1.65 5.5 V
V
IH
High-level input voltage
SCL, SDA 0.7 × V
CC
6
V
A2–A0, RESET 0.7 × V
CC
V
CC
+ 0.5
V
IL
Low-level input voltage
SCL, SDA –0.5 0.3 × V
CC
V
A2–A0, RESET –0.5 0.3 × V
CC
T
A
Operating free-air temperature –40 85 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC
(1)
TCA9548A
UNITPW (TSSOP) RGE (VQFN)
24 PINS 24 PINS
R
θJA
Junction-to-ambient thermal resistance 108.8 57.2 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 54.1 62.5 °C/W
R
θJB
Junction-to-board thermal resistance 62.7 34.4 °C/W
ψ
JT
Junction-to-top characterization parameter 10.9 3.8 °C/W
ψ
JB
Junction-to-board characterization parameter 62.3 34.4 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A 15.5 °C/W