LMV358 datasheet
Table Of Contents
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV324QPWR TSSOP PW 14 2000 346.0 346.0 29.0
LMV324SIDR SOIC D 16 2500 333.2 345.9 28.6
LMV324SIPWR TSSOP PW 16 2000 346.0 346.0 29.0
LMV358IDDUR VSSOP DDU 8 3000 202.0 201.0 28.0
LMV358IDGKR MSOP DGK 8 2500 358.0 335.0 35.0
LMV358IDGKR MSOP DGK 8 2500 370.0 355.0 55.0
LMV358IDR SOIC D 8 2500 340.5 338.1 20.6
LMV358IDR SOIC D 8 2500 346.0 346.0 29.0
LMV358IPWR TSSOP PW 8 2000 346.0 346.0 29.0
LMV358QDDUR VSSOP DDU 8 3000 202.0 201.0 28.0
LMV358QDGKR MSOP DGK 8 2500 358.0 335.0 35.0
LMV358QDR SOIC D 8 2500 340.5 338.1 20.6
LMV358QPWR TSSOP PW 8 2000 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Apr-2009
Pack Materials-Page 3