LMV358 datasheet
Table Of Contents
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
LMV358IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LMV358IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LMV358QDDUR VSSOP DDU 8 3000 180.0 9.2 2.25 3.35 1.05 4.0 8.0 Q3
LMV358QDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMV358QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LMV358QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV321IDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
LMV321IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
LMV321IDBVT SOT-23 DBV 5 250 205.0 200.0 33.0
LMV321IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
LMV321IDCKR SC70 DCK 5 3000 180.0 180.0 18.0
LMV321IDCKR SC70 DCK 5 3000 205.0 200.0 33.0
LMV321IDCKT SC70 DCK 5 250 205.0 200.0 33.0
LMV321IDCKT SC70 DCK 5 250 180.0 180.0 18.0
LMV324IDR SOIC D 14 2500 346.0 346.0 33.0
LMV324IPWR TSSOP PW 14 2000 346.0 346.0 29.0
LMV324QDR SOIC D 14 2500 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Apr-2009
Pack Materials-Page 2