LMV358 datasheet
Table Of Contents
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
LMV321IDBVR SOT-23 DBV 5 3000 180.0 9.2 3.23 3.17 1.37 4.0 8.0 Q3
LMV321IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
LMV321IDBVT SOT-23 DBV 5 250 180.0 9.2 3.23 3.17 1.37 4.0 8.0 Q3
LMV321IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
LMV321IDCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
LMV321IDCKR SC70 DCK 5 3000 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3
LMV321IDCKT SC70 DCK 5 250 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3
LMV321IDCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
LMV324IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LMV324IPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
LMV324QDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LMV324QPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
LMV324SIDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
LMV324SIPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
LMV358IDDUR VSSOP DDU 8 3000 180.0 9.2 2.25 3.35 1.05 4.0 8.0 Q3
LMV358IDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMV358IDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1
LMV358IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Apr-2009
Pack Materials-Page 1