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MZ-E501

AEP Model

Hong Kong Model

SERVICE MANUAL

PORTABLE MINIDISC PLAYER

Ver 1.2 2001. 12

With SUPPLEMENT-1

Model Name Using Similar Mechanism MZ-E500

MD Mechanism Type MT-MZE500-174

Optical Pick-up Mechanism Type LCX-4E

US and foreign patents licensed from Dolby

Laboratories Licensing Corporation

SPECIFICATIONS

Audio playing system

MiniDisc digital audio system

Laser diode properties

Material: GaAlAs

Wavelength: λ = 790 nm

Emission duration: continuous

Laser output: less than 44.6 µW*

* This output is the value measured at a distance of 200 mm from the

objective lens surface on the optical pick-up block with 7 mm aperture.

Revolutions

Approx. 300 rpm to 2,700 rpm

Error correction

ACIRC (Advanced Cross Interleave Reed Solomon Code)

Sampling frequency

44.1 kHz

Coding

ATRAC (Adaptive TRansform Acoustic Coding)

ATRAC3: LP2

ATRAC3: LP4

Modulation system

EFM (Eight to Fourteen Modulation)

Number of channels

2 stereo channels

1 monaural channel

Frequency response

20 to 20,000 Hz ± 3 dB

Wow and Flutter

Below measurable limits

Outputs

Headphones/earphones: stereo mini-jack, maximum output level 5 mW +

5 mW, load impedance 16 ohms

Power requirements

Nickel Cadmium rechargeable battery

One NC-6WM (supplied): 1.2V, 600 mAh

One LR6 (size AA) battery (not supplied)

External power jack: Power rating 3V DC

AC power adaptor for the battery charging stand (supplied): AC230~240V,

50Hz

Battery operation time

See “When to replace or recharge the battery”

Dimensions

Approx. 74.5 × 80.5 × 17.9 mm (w/h/d) (3

× 3

in.)

(not including projecting parts and controls)

Mass

Approx. 80 g (2.8 oz) (the player only)

Supplied accessories

Headphones/earphones with a remote control (1)

Battery charging stand (assembly needed)(1)

AC power adaptor*

Rechargeable battery (1)

Rechargeable battery carrying case (1)

Dry battery case (1)

Carrying pouch (1)

AC plug adaptor (1) (world model only)

US and foreign patents licensed from Dolby Laboratories.

Design and specifications are subject to change without notice.

Sony Corporation

Personal Audio Company

Published by Sony Engineering Corporation

9-873-162-03

2001L1600-1

Summary of content (56 pages)

PAGE 1
MZ-E501 SERVICE MANUAL AEP Model Hong Kong Model Ver 1.2 2001.
PAGE 2
MZ-E501 TABLE OF CONTENTS 1. SERVICING NOTE ···················································· 3 2. GENERAL ·································································· 4 3. DISASSEMBLY 3-1. 3-2. 3-3. 3-4. 3-5.
PAGE 3
MZ-E501 SECTION 1 SERVICING NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.
PAGE 4
MZ-E501 SECTION 2 GENERAL This section is extracted from instruction manual. LOCATION AND FUNCTION OF CONTROLS VOL+ . GROUP VOL+/– x VOL– 1N> X . 3 Color Info-LED >N PLAYMODE DISPLAY x RPT/ENT SOUND HOLD .
PAGE 5
MZ-E501 SECTION 3 DISASSEMBLY r Disassemble the unit in the order as shown below. Set Case assy, Holder assy Mechanism deck Bracket assy MAIN board Optical pick-up assy (LCX-4E) Note : Follow the disassembly procedure in the numerical order given. 3-1. CASE ASSY, HOLDER ASSY case assy 1 screws (1.4), MI 1 screws (1.
PAGE 6
MZ-E501 3-2. MECHANISM DECK 1 step screw (MD) mechanism deck 6 MOTER FLEXIBLE board (CN551) 5 OP FLEXIBLE board (CN501) 4 2 claw 3 claw 3 claw 3-3. BRACKET ASSY 3 screw (1.7) 1 screw (1.
PAGE 7
MZ-E501 3-4. MAIN BOARD 1 screw (1.7) 5 Remove the soldering 7 battery case assy 6 MAIN board 5 Remove the soldering 2 claw 4 ornamental strip 3 battery case lid case (rear) 3-5. OPTICAL PICK-UP ASSY (LCX-4E) optical pick-up assy (LCX-4E) 1 washer 2 gear (SA) 5 3 screw (MI 1.
PAGE 8
MZ-E501 SECTION 4 TEST MODE 4-1. GENERAL Remote control LCD • When entered in the TEST MODE, this set provides the Overall Adjustment mode which allows CD and MO discs to be automatically adjusted. In the Overall Adjustment mode, the system discriminates between CD and MO discs, performs adjustments in sequence automatically, and displays the faulty location if any fault is found. In the Manual mode, selected adjustments can be performed automatically.
PAGE 9
MZ-E501 4-4. MANUAL MODE 4. During each test mode, the display is changed from one to another each time DISPLAY key is pressed. 4-4-1. Outline of the function The Manual mode is designed to perform adjustments and operational checks on the set’s operation according to each individual function. Usually, no adjustments are made in this mode. However, the Manual mode is used to clear the memory before performing automatic adjustments in the Overall Adjustment mode. 4-4-2. How to set the Manual mode 1.
PAGE 10
MZ-E501 4-6. SELF-DIAGNOSTIC DISPLAY MODE 4-6-1. Outline of the function 3. Hereinafter, each time > N key is pressed, the reference information display changes as follows: The Self-diagnostic system is used in this set. If an error occurs during playback, this system detects the fault through the microprocessor’s mechanism and power control blocks and stores the cause in EEPROM in a history format.
PAGE 11
MZ-E501 4-7. Sound Skip Check Result Display Mode This set can display and check the error count occurring during play. • Setting method of Sound Skip Check Result Display Mode 1. Setting the test mode. 2. Pressing the > N key activates the sound skip check result display mode where the LCD displays as shown below. LCD display 000 P**R## Total of record system error count Total of play system error count 3.
PAGE 12
MZ-E501 SECTION 5 ELECTRICAL ADJUSTMENTS 5-1. GENERAL 5-4. MANUAL POWER ADJUSTMENTS In this set, CD and MO discs can be automatically adjusted by setting the Overall Adjustment mode within the TEST MODE, Before performing these automatic adjustments, it is necessary to clear the memory and adjust the power in the Manual mode. 5-4-1. Adjustment sequence The adjustments should be always performed in the following sequence: 5-2. NOTES FOR ADJUSTMENT 5-2-1.
PAGE 13
MZ-E501 5-4-3. Vc PWM Duty (H) adjustment method 1. Set the Manual mode and set the item No. to 763. 3. Press X key to write the adjustment value. The adjustment completion display appears as follows. LCD display LCD display 763 VchPWM XX 2. Connect a digital voltmeter to TP901(VC) on the main board and adjust VOL+ key and VOL– key on the remote control. Adjustment value:2.75V Standard value:2.74 to 2.755V MAIN BOARD (SIDE B) 000 ADJ OK 5-4-5.
PAGE 14
MZ-E501 3. If NG in the overall CD adjustments, return to Reset NV and perform from the electrical offset adjustment again. Item No. Contents 030 GRV setting • Sarvo OFF • Head UP 035 Laser ON/OFF electrical offset difference measurement Completed LCD display 000 XXX NG XXX: NG item No. 4. If OK through the overall CD adjustments, then perform overall MO adjustments. LCD display XXX CD OK 5. Insert MO disc in the set, and press > N key to set the Overall MO Adjustment mode.
PAGE 15
MZ-E501 Item No.
PAGE 16
MZ-E501 SECTION 6 DIAGRAMS Note on Printed Wiring Boards: MAIN SECTION • X : parts extracted from the component side. • : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.) Caution: Pattern face side: Parts on the pattern face side seen from the (Side B) pattern face are indicated. Parts face side: Parts on the parts face side seen from the (Side A) parts face are indicated. • Main boards is four-layer pritnted board.
PAGE 17
MZ-E501 6-1.
PAGE 18
MZ-E501 6-2. PRINTED WIRING BOARD – MAIN SECTION (SIDE A) – 1 3 2 4 5 6 7 8 9 10 MAIN BOARD (SIDE A) A • Semiconductor Location Ref. No. E IC 301 S801 x B * IC 601 CSP (Chip Size Package) S806 GROUP C D S803 . S808 HOLD E OFF ON S804 VOL– DRY BATTERY SIZE "AA" (IEC DESIGNATION LR6) 1PC, 1.
PAGE 19
MZ-E501 6-3. PRINTED WIRING BOARD – MAIN SECTION (SIDE B) – 1 3 2 MAIN BOARD (SIDE B) A 4 5 6 7 8 9 10 TO OPTICAL PICK-UP BLOCK (LCX-4E) TO MOTOR FLEXIBLE BOARD (M901 : SPINDLE MOTOR) (M902 : SLED MOTOR) • Semiconductor Location Ref. No. IC 801 B C609 R COM J301 C L TAP601 (TEST) RGND TP904 (VL) R-KEY R-DATA D TP901 (VC) RVDD E S809 (OPEN/CLOSE DETECT SWITCH) IC 551 F 1-681-868- G RECHARGEABLE BATTERY NC-6WM 1PC, 1.
PAGE 20
MZ-E501 6-4. SCHEMATIC DIAGRAM – MAIN SECTION (1/3) – • See page 16 for Waveforms. • See page 25, 26 for IC Pin Function Description.
PAGE 21
MZ-E501 6-5. SCHEMATIC DIAGRAM – MAIN SECTION (2/3) – • See page 23, 24 for IC Block Diagrams. IC B/D IC B/D C956 0.
PAGE 22
MZ-E501 6-6. SCHEMATIC DIAGRAM – MAIN SECTION (3/3) – • See page 23 for IC Block Diagrams.
PAGE 23
MZ-E501 6-7.
PAGE 24
MZ-E501 VAFB VDFB VIFFB GND VC VCO VC VCOUT L1 NC PGND1 PGND1 42 41 40 39 38 37 36 35 34 33 32 31 30 29 VIF VA IC901 XPC18A32FCR2 NC 43 VG SERIAL PASS REGULATOR VA VD 44 STEP-UP PRE DRIVEER POWER SWITCH 1 28 L1 VG VG STEP-UP PRE DRIVEER 27 RF1 SERIAL PASS REGULATOR VD VC2 45 SERIAL PASS REGULATOR VIF 26 INM1 XRST (INT) XRST 46 25 DTC1 VC VC VC 24 DTC2 PWM CRST 47 VC RSTREF 48 23 RF2 VC BANDGAP REFERENCE VREF 49 22 INM2 VG VC VB 50 21 PWM1 VG GND 51 VC
PAGE 25
MZ-E501 6-8. IC PIN FUNCTION DESCRIPTION • IC501 SN761057DBT (RF AMP, FOCUS/TRACKING ERROR AMP) Pin No. Pin Name I/O 1 TE O Tracking error signal output to the system controller (IC601) Description 2 REXT I Connect terminal to the external resistor for ADIP amp control 3 WPPLPF I Connect terminal to the external capacitor for TPP/WPP low-pass filter 4 VREF O Reference voltage output terminal (+1.
PAGE 26
MZ-E501 • IC601 CXD2671-205GA (SYSTEM CONTROL) Pin No.
PAGE 27
MZ-E501 Pin No.
PAGE 28
MZ-E501 Pin No.
PAGE 29
MZ-E501 Ver 1.2 2001.12 Pin No.
PAGE 30
MZ-E501 Pin No.
PAGE 31
MZ-E501 SECTION 7 EXPLODED VIEWS NOTE: • -XX, -X mean standardized parts, so they may have some differences from the original one. • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded views are not supplied. • • Ver 1.2 2001.12 Hardware (# mark) list and accessories and packing materials are given in the last of this parts list.
PAGE 32
MZ-E501 7-2. MECHANISM SECTION 65 55 54 53 56 57 M902 M901 61 59 60 58 62 64 63 51 52 Ref. No. Part No. Description 51 52 53 54 55 1-680-453-11 3-222-392-01 3-222-394-01 3-224-779-01 4-222-216-01 MOTOR FLEXIBLE BOARD SCREW (M1.4), TAPPING CHASSIS SPRING, THRUST DETENT GEAR (SA) 56 57 58 59 60 3-338-645-51 4-218-233-01 4-218-233-13 4-222-208-01 3-043-237-02 WASHER SCREW (1.4), MI SCREW (1.4), MI GEAR (SB) BEARING (N) Remarks Ref. No. Part No.
PAGE 33
MZ-E501 SECTION 8 ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. • -XX, -X mean standardized parts, so they may have some difference from the original one. • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • • • Ref. No. Part No.
PAGE 34
MZ-E501 MAIN Ref. No. C956 C963 Part No. Description 1-107-820-11 CERAMIC CHIP 1-107-820-11 CERAMIC CHIP Remarks 0.1uF 0.1uF 16V 16V < CONNECTOR > ∗ CN501 ∗ CN551 1-778-168-11 CONNECTOR, FFC/FPC (ZIF) 20P 1-793-124-11 CONNECTOR, FPC (ZIP) 8P < DIODE > D101 D201 D801 D855 D901 8-719-064-91 8-719-064-91 8-719-085-54 8-719-066-17 8-719-081-33 DIODE 02DZ2.4-Z(TPH3) DIODE 02DZ2.4-Z(TPH3) LED KPTB-1612SURKSGC (INFO) DIODE FTZ6.
PAGE 35
MZ-E501 Ver 1.1 2001.11 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description < SWITCH > S801 S802 S803 S804 S805 1-786-033-11 1-786-033-11 1-786-033-11 1-786-033-11 1-786-033-11 SWITCH, TACTILE (x) SWITCH, TACTILE (>N) SWITCH, TACTILE (.
PAGE 36
MZ-E501 MEMO 36
PAGE 37
MZ-E501 AEP Model Hong Kong Model SERVICE MANUAL Ver 1.2 2001. 12 SUPPLEMENT-1 Subject : 1. Schematic diagram and printed wiring board are changed.
PAGE 38
MZ-E501 How to distinguish the sets Parts code of printed wiring board are changed. Before change Part No. Description 1-681-868-11 MAIN BORD After change Part No. Description 1-681-868-12 MAIN BORD Location of parts code on changed printed wiring board.
PAGE 39
MZ-E501 SECTION 2 DIAGRAMS 2-1.
PAGE 40
MZ-E501 2-2. PRINTED WIRING BOARD – MAIN SECTION (SIDE A) – 1 2 3 4 5 6 7 8 9 10 11 12 13 14 MAIN BOARD (SIDE A) E • Semiconductor IC 301 Location 1 18 S801 5 6 15 13 10 12 B 7 A Ref. No.
PAGE 41
MZ-E501 2-3. PRINTED WIRING BOARD – MAIN SECTION (SIDE B) – 1 2 A 3 4 5 6 7 9 10 11 12 13 14 TO OPTICAL PICK-UP BLOCK (LCX-4E) TO MOTOR FLEXIBLE BOARD (M901 : SPINDLE MOTOR) (M902 : SLED MOTOR) MAIN BOARD (SIDE B) 8 B • Semiconductor Location Ref. No.
PAGE 42
MZ-E501 2-4. SCHEMATIC DIAGRAM – MAIN SECTION (1/3) – • See page 11, 12 for IC Pin Function Description. Note on Schematic Diagram r WAVEFORMS 1 IC501 1 TE 2 Approx. 12 mVp-p IC501 ed (RF OUT) Approx. 1.2 Vp-p 3 IC501 rs (FE) 4 Approx. 10 mVp-p • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. • All resistors are in Ω and 1/4 W or less unless otherwise specified. f • : internal component. • : B+ Line.
PAGE 43
MZ-E501 2-5. SCHEMATIC DIAGRAM – MAIN SECTION (2/3) – • See page 9, 10 for IC Block Diagrams. IC B/D IC B/D Note on Schematic Diagram • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. • All resistors are in Ω and 1/4 W or less unless otherwise specified. • : B+ Line. • Power voltage is dc 1.5V and fed with regulated dc power supply from battery terminal.
PAGE 44
MZ-E501 2-6. SCHEMATIC DIAGRAM – MAIN SECTION (3/3) – • See page 9 for IC Block Diagrams. IC B/D Note on Schematic Diagram • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. • All resistors are in Ω and 1/4 W or less unless otherwise specified. • C : panel designation. • : B+ Line. • Power voltage is dc 1.5V and fed with regulated dc power supply from battery terminal.
PAGE 45
MZ-E501 6-7.
PAGE 46
MZ-E501 VAFB VDFB VIFFB GND VC VCO VC VCOUT L1 NC PGND1 PGND1 42 41 40 39 38 37 36 35 34 33 32 31 30 29 VIF VA IC901 XPC18A32FCR2 NC 43 VG SERIAL PASS REGULATOR VA VD 44 STEP-UP PRE DRIVEER POWER SWITCH 1 28 L1 VG VG STEP-UP PRE DRIVEER 27 RF1 SERIAL PASS REGULATOR VD VC2 45 SERIAL PASS REGULATOR VIF 26 INM1 XRST (INT) XRST 46 25 DTC1 VC VC VC 24 DTC2 PWM CRST 47 VC RSTREF 48 23 RF2 VC BANDGAP REFERENCE VREF 49 22 INM2 VG VC VB 50 21 PWM1 VG GND 51 VC
PAGE 47
MZ-E501 6-8. IC PIN FUNCTION DESCRIPTION • IC501 SN761057DBT (RF AMP, FOCUS/TRACKING ERROR AMP) Pin No. Pin Name I/O 1 TE O Tracking error signal output to the system controller (IC601) Description 2 REXT I Connect terminal to the external resistor for ADIP amp control 3 WPPLPF I Connect terminal to the external capacitor for TPP/WPP low-pass filter 4 VREF O Reference voltage output terminal (+1.
PAGE 48
MZ-E501 • IC601 CXD2671-207GA (SYSTEM CONTROL) Pin No.
PAGE 49
MZ-E501 Pin No.
PAGE 50
MZ-E501 Pin No.
PAGE 51
MZ-E501 Pin No.
PAGE 52
MZ-E501 Pin No.
PAGE 53
MZ-E501 SECTION 2 ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. • -XX, -X mean standardized parts, so they may have some difference from the original one. • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • • • Ref. No. Part No.
PAGE 54
MZ-E501 MAIN Ref. No. C954 C955 C956 C963 Part No. Description 1-107-820-11 1-107-820-11 1-107-820-11 1-107-820-11 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP Remarks Part No. Description R302 R303 R501 R503 R505 1-218-963-11 1-218-981-11 1-218-971-11 1-218-953-11 1-208-691-11 RES-CHIP RES-CHIP RES-CHIP RES-CHIP METAL CHIP 6.8K 220K 33K 1K 2.2K 5% 5% 5% 5% 0.
PAGE 55
MZ-E501 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks < COMPOSITION CIRCUIT BLOCK > RB301 RB302 RB551 RB552 RB553 1-233-970-11 1-233-966-11 1-233-959-11 1-233-973-11 1-233-967-11 RES, NETWORK (CHIP TYPE) 33K RES, NETWORK (CHIP TYPE) 6.
PAGE 56
MZ-E501 REVISION HISTORY Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page. Ver. Date 1.2 2001.12 Description of Revision Supplement-1:Change of board (1-681-868-11→1-681-868-12) Correction of IC pin function description and exploded views (ECN-DAB01214) 1.1 2001.11 AEP, French model addition 1.0 2001.