HCD-DX30/RG40 SERVICE MANUAL US Model Canadian Model AEP Model Ver 1.0 2001. 05 HCD-RG40 E Model Australian Model HCD-DX30 • HCD-DX30/RG40 is the tuner, deck, CD and amplifier section in MHC-DX30/RG40.
HCD-DX30/RG40 SAFETY CHECK-OUT Tape deck section Recording system Frequency response 4-track 2-channel stereo 40 – 13,000 Hz (±3 dB), using Sony TYPE I cassette Tuner section FM stereo, FM/AM superheterodyne tuner After correcting the original service problem, perform the following safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.
HCD-DX30/RG40 NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT TABLE OF CONTENTS 1. SERVICE NOTE ······························································· 4 The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body.
HCD-DX30/RG40 SECTION 1 SERVICE NOTE 4
HCD-DX30/RG40 SECTION 2 GENERAL This section is extracted from instruction manual.
HCD-DX30/RG40 Remote Control 1 2 34 5 6 ql 7 qk qj qh qg 8 9 0 qf qd qa qs CD qj CLEAR 6 CLOCK/TIMER SELECT 2 CLOCK/TIMER SET 3 D.SKIP ql EFFECT ON/OFF qa ENTER qf GAME qk MD (VIDEO) 9 P FILE qd PRESET EQ qg SLEEP 1 SURROUND 0 TAPE A/B 8 TUNER/BAND qh VOL +/– 7 BUTTON DESCRIPTIONS v/V/b/B qs M (fast forward)/TUNING +5 . (go back)/PRESET –5 ?/1 (power) 4 x (stop) 5 nN (play) 5 X (pause) 5 > (go forward)/PRESET +5 m (rewind)/TUNING – 5 Setting the time 1 Turn on the system.
HCD-DX30/RG40 SECTION 3 DISASSEMBLY Note : Disassemble the unit in the order as shown below. Set Case (Top) CD door Driver board, Moter board and Address sensor board Base unit Front panel section Tape mechanism deck Panel board Key board Sub trans board, Trans board, Sensor board and Video out board Main board and Power board Note : Follow the disassembly procedure in the numerical order given. 3-1.
HCD-DX30/RG40 3-2. CD DDOR CD door CD mechanism deck (CDM58B) 1 Turn the pulley to the direction of arrow. Front panel side 3 pulley 2 Pull-out the disc tray. 3-3.
HCD-DX30/RG40 3-4. TAPE MECHANISM DECK 1 Six screws (+BVTP 2.6 × 8) 2 Tape mechanism deck 3-5. PANEL BOARD 3 6 Panel board 4 Connector 13p (CN712) 2 Vol knob ring 1 Volume knob 5 Cut the seven melted-connection points with a cutting plier. Note: When attching the panel board, refer to "Service Note" on page 4.
HCD-DX30/RG40 3-6. KEY BOARD 2 Key board 1 Cut the six melted-connection points with a cutting plier. Note: When attching the Key board, refer to "Service Note" on page 4. 3-7.
HCD-DX30/RG40 3-8. MAIN BOARD AND POWER BOARD 7 Heat sink 6 Two screws (+BVTT 3 × 6) 4 Three screws (+BVTT 3 × 6) Main board 5 Power board 3 Two screws (+BVTP 3 × 16) 2 Main board 1 Two screws (+BVTT 3 × 6) 3-9. BASE UNIT 1 Screw (+PTPWH M2.6) 2 Holder (BU) assy qa Base unit q; Screw (DIA. 12) qs Two insulators qs Two insulators 9 Two screws (+PTPWH M2.6) 8 Two stoppers (BU) 7 Two screws (+BVTP 2.6 × 8) 4 Wire (flat type) 16p (CN102) 3 Wire (flat type) 19p (CN101) 6 BD board 5 Screw (+BVTP 2.
HCD-DX30/RG40 3-10. DRIVER BOARD, MOTOR BOARD AND ADDRESS SENSOR BOARD q; Screw (+PTPWH 2.6 × 8) 4 Two screws (+BVTP 2.6 × 8) 8 Motor board 6 Wire (flat type) 8p (CN721) qs Screw (+BVTP 2.6 × 8) qa Tray 3 Wire (flat type) 8p (CN702) 2 Driver board 1 Screw (+BVTP 2.6 × 8) 9 Pull-out the disc tray. 12 5 Remove the two solderings of motor.
HCD-DX30/RG40 SECTION 4 TEST MODE [MC Cold Reset] • The cold reset clears all data including preset data stored in the RAM to initial conditions. Execute this mode when returning the set to the customer. Procedure: 1. Press three buttons x , ENTER , and ?/1 simultaneously. 2. The fluorescent indicator tube displays “COLD RESET” and the set is reset. [CD Ship Mode] • This mode moves the pickup to the position durable to vibration. Use this mode when returning the set to the customer after repair.
HCD-DX30/RG40 [MC Test Mode] • This mode is used to check operations of the respective sections of Amplifier, TUNER, CD and Tape. Procedure: 1. Press the ?/1 button to turn on the set. 2. Press the three buttons of x , ENTER and DISC 3 simultaneously. 3. A message “TEST MODE” appears on the FL display tube. • The messages VACS1 to VACS5 are displayed when the VACS is changed in this mode. • The number of repeats of TAPE and CD is set to the infinite number as the default setting.
HCD-DX30/RG40 [Aging Mode] This mode can be used for operation check of CD section and tape deck section. • If an error occurred: The aging operation stops and display status. • If no error occurs: The aging operation continues repeatedly. 1. Operating method of Aging Mode Turn on the main power and select “CD” of the function. 1) Set a disc in DISC1 tray. Select ALL DISC CONTINUE, and REPEAT OFF. 2) Load the tapes recording use into the decks A and B respectively.
HCD-DX30/RG40 2) Operation during aging mode In the aging mode, the program is executed in the following sequence. (1) The disc tray opens and closes. (2) The mechanism accesses DISC 2 and makes an attempt to read TOC. However, since there are no discs, a message “CD2 NO DISC” appears. (3) The mechanism accesses DISC 3 and a message “CD3 NO DISC” appears. (4) The disc tray turns to select a disc1. (5) A disc is chucked. (6) TOC of disc is read. (7) The pickup accesses to the track 1, and playing 2 seconds.
HCD-DX30/RG40 SECTION 5 ELECTRICAL ADJUSTMENTS FM Tuned Level Adjustment CD SECTION FM RF Signalgenerator Note : 75 Ω coaxial set Carrier frequency : 98 MHz Modulation : AUDIO 1 kHz, 75 kHz deviation (100%) Output level : 28 dB (at 75 Ω open) FM ANTENNA terminal (TM101) 1. CD Block is basically designed to operate without adjustment. Therefore, check each item in order given. 2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated. 3. Use an oscilloscope with more than 10MΩ impedance. 4.
HCD-DX30/RG40 Note : Clear RF signal waveform means that the shape “ ◊ ” can be clearly distinguished at the center of the waveform. Adjustment Location: [BD BOARD] (Conductor Side) RF signal waveform VOLT/DIV : 200mV TIME/DIV : 500ns level : 1.45 ± 0.3Vp-p E-F Balance (1 Track jump) Check oscilloscope BD board TP (AGCCON) TP(TEO) TP(VC) 12 Procedure : 1. Connect oscilloscope to TP (TEO) and TP (VC). 2. Turned Power switch on. 3. Load a disc (YEDS-18) and playback the number five track. 4.
HCD-DX30/RG40 SECTION 6 DIAGRAMS THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.) Note on Schematic Diagram: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. • All resistors are in Ω and 1/4 W or less unless otherwise specified. ¢ • : internal component. • C : panel designation.
HCD-DX30/RG40 6-1. CIRCUIT BOARD LOCATION MOTOR board ADDRESS SENSOR board VIDEO OUT board DRIVER board BD board SUB TRANS board TRANS board SENSOR board PANEL board MAIN board KEY board POWER AMP board • WAVEFORMS – MAIN BOARD – – BD BOARD – 1 IC101 yj 3 IC101 ra CD PLAY MODE 1 IC102 wf STOP MODE approx 200mVp-p 6.4Vp-p 2 IC101 ta 4 IC101 el CD PLAY MODE 4.1Vp-p 222ns (4.5MHz) 1.2Vp-p 2 IC401 qd STOP MODE 4.0Vp-p 63ns (16.0MHz) 3 IC401 qa STOP MODE 31µs (32.768kHz) 5.
HCD-DX30/RG40 6-2. BLOCK DIAGRAMS TUNER/CD SECTION EXCEPT US,CND,AEP MODEL TM101 FE101 1 ANT IN CF101 IF OUT 7 FM 75Ω AM/FM IF MPX IC101 Q101 CF102 RF IF AMP 1 FM IF BUFFER Q103 L OUT 11 L-CH OSC OUT 8 VT 5 R OUT 10 • RCH is omitted A • Signal Path MAIN SECTION R-CH : FM Q102 G +B US,CND MODEL ONLY TU+12V AM 8 ANT IN IFT101 IF OUT 1 PLL IC102 US,CND MODEL JR109 F OUT 3 X101 4.
HCD-DX30/RG40 MAIN SECTION INPUT SELECT TONE/VOL CONT IC301 TUNER SECTION CD SECTION A B L-CH 43 TUNER/L LOUT OUT R 31 42 CD/L JK301 L-CH L POWER AMP 6 Q301 MUTE CONT MUTE Q365 Q363 MUTE CONT MUTE Q381,382 Q503,504 Q581 Q501 MUTE CONT MUTE OVER LOAD DETECTOR Q384,385 PROTECT DETECTOR 12 47 MD/L • Signal Path L R-CH Q361,362 • RCH is omitted CN301 IC501 1 OUT L 32 SPEAKER RY371 R CH D502 Q383 Q386,387 PROTECT CONT PROTECT SWITCH : PB (DECK B) R CH J701 R-CH JK70
HCD-DX30/RG40 6-3. SCHEMATIC DIAGRAM MAIN SECTION (1/4) • See page 20 for Wavefoms. • See page 42 for IC Block Diagrams.
HCD-DX30/RG40 6-4. SCHEMATIC DIAGRAM MAIN SECTION (2/4) • See page 43 for IC Block Diagrams.
HCD-DX30/RG40 6-5.
HCD-DX30/RG40 6-6. SCHEMATIC DIAGRAM MAIN SECTION (4/4) • See page 20 for Wavefoms. • See page 40 for IC Pin Function Description.
HCD-DX30/RG40 6-7. PRINTED WIRING BOARD MAIN SECTION • See page 20 for Circuit Boards Location. • Semiconductor Location Ref. No.
HCD-DX30/RG40 6-8. PRINTED WIRING BOARD BD SECTION • Semiconductor Location Ref. No.
HCD-DX30/RG40 6-9. SCHEMATIC DIAGRAM BD SECTION • See page 20 for Wavefoms. • See page 43, 44 for IC Block Diagrams.
HCD-DX30/RG40 6-10. PRINTED WIRING BOARD POWER AMP SECTION • See page 20 for Circuit Boards Location. POWER AMP BOARD • Semiconductor SENSOR BOARD IC501 Location Ref. No.
HCD-DX30/RG40 6-11.
HCD-DX30/RG40 6-12. PRINTED WIRING BOARD PANEL SECTION • See page 20 for Circuit Boards Location. • Semiconductor PANEL BOARD Location A Ref. No.
HCD-DX30/RG40 6-13. SCHEMATIC DIAGRAM PANEL SECTION • See page 20 for Wavefoms. • See page 41 for IC Pin Function Description. 0 4 .9 3 .
HCD-DX30/RG40 6-14. PRINTED WIRING BOARD KEY SECTION • See page 20 for Circuit Boards Location. • Semiconductor KEY BOARD Location Ref. No.
HCD-DX30/RG40 6-15.
HCD-DX30/RG40 6-16. PRINTED WIRING BOARD DRIVER SECTION • See page 20 for Circuit Boards Location.
HCD-DX30/RG40 6-17. SCHEMATIC DIAGRAM DRIVER SECTION • See page 43 for IC Block Diagrams.
HCD-DX30/RG40 6-18. PRINTED WIRING BOARD TRANS SECTION • See page 20 for Circuit Boards Location.
HCD-DX30/RG40 6-19.
HCD-DX30/RG40 6-20. IC PIN FUNCTION DESCRIPTION • MAIN BOARD IC401 M30622MCA-B23FP (MASTER CONTROL) Pin No. Pin Name I/O Pin No. Pin Name I/O 1 S-OUT O Serial data output the display control. Description 51 NO USE — Not used. Description 2 S-CLK O Serial clock output from main controller. 52 CENT-MUTE — Not used. 3 S-BSY I Busy signal input from the display control. “L” : busy 53 REAR-MUT — Not used. 4 REMOTE IN I Pemoto commander input. 54 494-DAT — Not used.
HCD-DX30/RG40 • PANEL BOARD IC701 UPD780232GC-031-8BT (DISPLAY CONTROL) Pin No. Pin Name I/O 1 VDD — Power supply.(+5V) Description 2 VSS — Connected to ground. 3 X1 O System clock output terminal.(5MHz) 4 X2 I System clock input terminal.(5MHz) 5 IC 6 RESET I Reset signal input from main controller. 7 S-CLK I Serial clock input from main controller. 8 S-IN I 9 S-OUT I 10 SBSY 11 NO USE — Not used. 12 NO USE — Not used. 13 VOL-A I VOLUME A signal input.
HCD-DX30/RG40 6-21. IC BLOCK DIAGRAMS AM OSC OUT V . REG AM OSC FM BAND WIDTH AM RF IN AM MIX OUT AM IF IN AM AGC FM/AM DET OUT AM MPX IN FM MPX IN VCO STOP IC101 BA1450 (MAIN BOARD) 24 23 22 21 20 19 18 17 16 15 14 13 AM OSC AM IF AM MIX SD VREG AM DET AGC 1/2 SW 1/2 PD 10 11 12 AM/FM 9 XOUT VSS AOUT2 AIN2 PD2 PD1 AIN1 AOUT1 VDD FMIN AMIN I02 IC102 LC72130 (MAIN BOARD) 24 23 22 21 20 19 18 17 16 15 14 13 SWALLOW COUNTER 1/16.
HCD-DX30/RG40 IC201 TA8189N (MAIN BOARD) ALC 17 16 15 14 13 – + CH2 CONTROL LOGIC A/B VREF1 ALC IREF 1 2 3 4 5 6 7 8 9 RIN CH2 – + TSD GND 18 REC IN FIN 19 NF VCC 20 REC OUT VM 21 CG OUT1 22 PRE TAPE A OUT /TAPE B VCC RNF 23 METAL OUT OUT2 24 NF VREF CH2/A CH2/B IC701 BA6956AN (DRIVER BOARD) VREF2 M/N CH1 + – CH1 + – GND 1 2 CH1/A CH1/B GND 3 4 5 6 7 8 9 10 11 12 NF METAL OUT PRE OUT MIX OUT GND1 M/H REC OUT NF REC IN GND VDD VSS AV
HCD-DX30/RG40 PRFVCC CH4BIN CH4SIN' CH4SIN CH3FIN CH3RIN CAPAIN3 GND MUTE POWVCC CH3OUTR CH3OUTF CH4OUTR CH4OUTF IC102 BA5974P (BD BOARD) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 F R R MUTE INTERFACE F LEVEL SHIFT THERMAL SHUTDOWN F INTERFACE F R F R INTERFACE IC103 CXA2568M-T (BD BOARD) VCC APC PD AMP 24 VCC 23 LC/PD 22 LD_ON VCC VEE HOLD 1 VEE AGCVTH 2 VREF APC LD AMP LD 3 VC PD VCC 4 A 5 B 6 C 7 D 8 VEE 9 21 HOLD_SW 20 AGCCONT (50%/30% OFF) 19
HCD-DX30/RG40 SECTION 7 EXPLODED VIEWS NOTE: • -XX, -X mean standardized parts, so they may have some differences from the original one. • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded views are not supplied. • Hardware (# mark) list and accessories and packing materials are given in the last of this parts list.
HCD-DX30/RG40 7-2. FRONT PANEL SECTION * 69 * For service only (Be sure to refer to "Service note" on page 4.) not supplied 61 69 58 * 69 62 59 60 70 not supplied FLD1 57 63 69 56 67 57 55 69 60 65 64 Part No. Description 66 54 68 53 51 52 Ref. No. Part No.
HCD-DX30/RG40 7-3. MAIN BOARD SECTION 105 T911 #3 #3 108 #2 106 #2 not supplied 107 104 #4 103 101 not supplied #2 102 Ref. No. Part No.
HCD-DX30/RG40 7-4. CD MECHANISM DECK SECTION 256 251 258 259 271 263 282 257 264 274 262 261 M721 not supplied 255 275 285 258 276 269 265 258 254 not supplied 260 268 266 279 271 not supplied 253 283 270 270 252 not supplied 283 251 267 271 284 270 283 288 286 258 284 258 287 Ref. No. Part No. Description 251 252 253 254 255 4-933-134-11 4-221-679-01 4-231-452-01 4-221-686-01 4-221-676-01 SCREW (+PTPWH M2.
HCD-DX30/RG40 SECTION 8 ELECTRICAL PARTS LIST ADDRESS SENSOR BD NOTE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. • -XX, -X mean standardized parts, so they may have some difference from the original one. • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • CAPACITORS: uF: µF Ref. No. Part No.
HCD-DX30/RG40 BD Ref. No. DRIVER KEY Part No. Description R111 R113 R114 R116 R117 1-216-121-11 1-216-121-11 1-216-073-00 1-216-001-00 1-216-049-11 RES-CHIP RES-CHIP RES-CHIP METAL CHIP RES-CHIP 1M 1M 10K 10 1K 5% 5% 5% 5% 5% 1/10W 1/10W 1/10W 1/10W 1/10W Remarks R118 R119 R123 R124 R131 1-216-025-11 1-216-059-00 1-216-073-00 1-216-097-11 1-216-033-00 RES-CHIP METAL CHIP RES-CHIP RES-CHIP METAL CHIP 100 2.
HCD-DX30/RG40 KEY Ref. No. Remarks Part No. Description Part No. Description S709 S710 S711 S712 S713 1-762-875-21 1-762-875-21 1-762-875-21 1-762-875-21 1-762-875-21 SWITCH, KEYBOARD(v) SWITCH, KEYBOARD(V) SWITCH, KEYBOARD(GROOVE) SWITCH, KEYBOARD(KARAOKE PON) (DX30) SWITCH, KEYBOARD(m -) C110 C111 C112 C113 C114 1-162-970-11 1-162-970-11 1-162-970-11 1-126-959-11 1-126-947-11 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP ELECT ELECT 0.01uF 0.01uF 0.01uF 0.47uF 47uF 10% 10% 10% 20.00% 20.
HCD-DX30/RG40 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description 25V (RG40:AEP) 10% 25V (RG40:AEP) 20.00% 50V (RG40:AEP) 5.00% 50V (RG40:AEP) 5.00% 50V (RG40:AEP) C235 C236 C237 C238 C239 1-126-960-11 1-126-933-11 1-162-962-11 1-162-977-11 1-130-485-00 ELECT ELECT CERAMIC CHIP CERAMIC CHIP MYLAR 1uF 100uF 470PF 0.0018uF 0.015uF 20.00% 20.00% 10% 10.
HCD-DX30/RG40 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description 16V 50V (RG40) 50V (DX30) 50V (RG40) 50V (DX30) C673 C674 C675 C676 C677 1-162-953-11 1-162-953-11 1-126-935-11 1-104-665-11 1-126-935-11 CERAMIC CHIP CERAMIC CHIP ELECT ELECT ELECT 100PF 100PF 470uF 100uF 470uF 5% 5% 20.00% 20.00% 20.00% 50V 50V 10V 10V 10V C678 C679 C681 C683 C684 1-162-953-11 1-162-953-11 1-136-165-00 1-136-165-00 1-136-165-00 CERAMIC CHIP CERAMIC CHIP FILM FILM FILM 100PF 100PF 0.
HCD-DX30/RG40 MAIN Ref. No. Part No. Description D374 D383 D601 D602 D661 8-719-988-61 8-719-988-61 8-719-988-61 8-719-988-61 8-719-988-61 DIODE DIODE DIODE DIODE DIODE 1SS355TE-17 1SS355TE-17 1SS355TE-17 1SS355TE-17 1SS355TE-17 Remarks Ref. No. Part No.
HCD-DX30/RG40 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No.
HCD-DX30/RG40 MAIN Ref. No. Part No. Description Part No. Description R112 R113 R114 R115 R116 1-216-829-11 1-216-829-11 1-216-829-11 1-216-833-11 1-216-809-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 4.7K 4.7K 4.7K 10K 100 5% 5% 5% 5% 5% Remarks 1/16W 1/16W 1/16W 1/16W 1/16W R206 R207 R208 R209 R210 1-216-805-11 1-216-832-11 1-216-832-11 1-216-850-11 1-216-850-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 47 8.2K 8.
HCD-DX30/RG40 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description R364 R365 R366 R367 R368 1-216-821-11 1-216-841-11 1-216-833-11 1-216-821-11 1-216-845-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 1K 47K 10K 1K 100K 5% 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W 1/16W 5% 1/16W 1/16W 1/16W (DX30) 1/16W (DX30) 1/16W R369 R370 1-216-837-11 METAL CHIP 1-216-829-11 METAL CHIP 22K 4.7K 5% 5% 1M 1M 1.5K 1.5K 4.
HCD-DX30/RG40 MAIN Ref. No. MOTOR Part No. Description Part No. Description R619 R620 R621 R622 R623 1-216-809-11 1-216-813-11 1-216-813-11 1-216-809-11 1-216-809-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 100 220 220 100 100 5% 5% 5% 5% 5% Remarks 1/16W 1/16W 1/16W 1/16W 1/16W Ref. No.
HCD-DX30/RG40 PANEL Ref. No. Part No. Remarks Ref. No. A-4476-797-A PANEL BOARD, COMPLETE (DX30:AR,AUS,E,E51,MX,SP) ********************** A-4725-721-A PANEL BOARD, COMPLETE (DX30:KR) ********************** A-4725-982-A PANEL BOARD, COMPLETE (DX30:TH) ********************** A-4726-035-A PANEL BOARD, COMPLETE (RG40) ********************** 7-685-872-09 SCREW +BVTT 3X8 (S) Description C756 1-162-294-31 CERAMIC 0.001uF C757 1-162-306-11 CERAMIC 0.01uF C758 1-126-956-11 ELECT 0.
HCD-DX30/RG40 PANEL Ref. No. Part No. Description Remarks < FERRITE BEAD > FB701 1-412-473-41 INDUCTOR 0UH < FLUORESCENT INDICATOR > FLD1 1-518-729-11 INDICATOR TUBE, FLUORESCENT < IC > IC701 6-800-220-01 IC uPD780232GC-031-8BT IC702 8-759-710-97 IC NJM4565M(TE2) (DX30) SEN701 8-759-827-70 IC NJL64H400A-1(g) < JACK > J701 J702 J704 1-691-293-21 JACK(PHONES)(VIDEO/AUDIO IN PUT) 1-815-603-11 JACK(MIC) (DX30) 1-815-684-11 JACK, PIN 3P Ref. No. Part No.
HCD-DX30/RG40 POWER AMP Ref. No. Part No. Remarks Ref. No.
HCD-DX30/RG40 POWER AMP SENSOR SUB TRANS Ref. No. Part No. 0 R508 1-217-156-00 METAL Description 0.22 20% Remarks R509 0 R510 1-260-076-11 CARBON 1-217-151-00 METAL 10 0.22 5% 10% 0 R510 1-217-156-00 METAL 0.22 20% 0 R511 1-212-881-11 FUSIBLE 100 5% 0 R512 R513 1-202-972-61 FUSIBLE 1-249-433-11 CARBON 1 22K 5% 5% R514 R515 R516 1-249-421-11 CARBON 1-249-433-11 CARBON 1-249-429-11 CARBON 2.
HCD-DX30/RG40 TRANS Ref. No. Part No. Description Remarks Ref. No. Part No. VIDEO OUT Description Remarks < SWITCH > 1-681-444-11 TRANS BOARD ************ 0 S901 1-786-055-11 SELECTOR, VOLTAGE (DX30:AR,E,E51,SP) 1-533-217-11 HOLDER, FUSE < TRANSFORMER > < CAPACITOR > C911 C912 C913 C915 1-128-553-11 1-126-964-11 1-126-968-11 1-164-159-11 ELECT ELECT ELECT CERAMIC 220uF 10uF 100uF 0.1uF 20.00% 63V 20.00% 50V 20.
HCD-DX30/RG40 REVISION HISTORY Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page. Ver. Date 1.0 2001.