Stereo System User Manual

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HCD-C5

AEP Model

UK Model

E Model

Australian Model

SERVICE MANUAL

MICRO HI-FI COMPONENT SYSTEM

Sony Corporation

Home Audio Company

Shinagawa Tec Service Manual Production Group

9-873-244-02

2001I1600-1

SPECIFICATIONS

Ver 1.1 2001. 09

HCD-C5 is the Amplifier, CD player, MD

Deck and Tuner section in CMT-C5.

Model Name Using Similar Mechanism New

CD Mechanism Type TN-CCD1001Z

Base Unit Name TT BASE ASSY

Optical Pick-up Name OPTIMA-720L1E

Model Name Using Similar Mechanism New

MD Mechanism Type MDM-7B4M

Optical Pick-up Name KMS-260E/Z-NP

Section

Amplifier section

European model:

DIN power output (rated): 15 + 15 W

(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

20 + 20 W

(6 ohms at 1 kHz, 10%

THD)

Music power output (reference):

45 + 45 W

Australian model:

The following measured at 230 V AC, 60 Hz

DIN power output (rated): 15 + 15 W

(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

20 + 20 W

(6 ohms at 1 kHz, 10%

THD)

Other models:

The following measured at 220 V AC, 60 Hz

DIN power output (rated): 15 + 15 W

(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

20 + 20 W

(6 ohms at 1 kHz, 10%

THD)

Inputs

TAPE IN (stereo minijack):

Sensitivity 250 mV,

impedance 47 kilohms

DIGITAL OPTICAL IN (Supported sampling

frequencies: 32 kHz, 44.1 kHz and 48 kHz)

Outputs

TAPE OUT (stereo minijack):

Sensitivity 250 mV,

impedance 1 kilohmes

PHONES (stereo minijack):

Accepts headphones with

an impedance of 8 ohms

or more

CD player section

System Compact disc and digital

audio system

Laser Semiconductor laser

(λ = 780 nm)

Emission

duration: continuous

Frequency response 2 Hz – 20 kHz

MD deck section

System MiniDisc digital audio

system

Laser Semiconductor laser

(λ=780 nm)

Emission duration:

continuous

Sampling frequency 44.1 kHz

Frequency response 5 Hz – 20 kHz

Tuner section

FM stereo, FM/AM superheterodyne tuner

FM tuner section

Tuning range 87.5 – 108.0 MHz

(50-kHz step)

Antenna FM wire antenna

Antenna terminals 75 ohm unbalanced

Intermediate frequency 10.7 MHz

AM tuner section

Tuning range

European model: 531 – 1,602 kHz

(with the tuning interval

set at 9 kHz)

Other models: 530 – 1,710 kHz

(with the tuning interval

set at 10 kHz)

531 – 1,602 kHz

(with the tuning interval

set at 9 kHz)

Antenna AM loop antenna, external

antenna terminal

Intermediate frequency 450 kHz

General

Power requirements

European model: 230 V AC, 50/60 Hz

Australian model: 230 V AC, 50/60 Hz

Other models: 220 V AC , 50/60 Hz

Power consumption

European model: See the nameplate

0.5 W (at the power

saving mode)

Other models: See the nameplate

Dimensions (w/h/d) Approx. 145 × 125 ×

273 mm incl. projecting

parts and controls

Mass Approx. 4.5 kg

Supplied accessories Remote commander (1)

AM loop antenna (1)

FM wire antenna (1)

Design and specifications are subject to change

without notice.

Summary of content (98 pages)

PAGE 1
HCD-C5 SERVICE MANUAL AEP Model UK Model E Model Australian Model Ver 1.1 2001. 09 HCD-C5 is the Amplifier, CD player, MD Deck and Tuner section in CMT-C5.
PAGE 2
HCD-C5 SELF-DIAGNOSIS FUNCTION The self-diagnosis function consists of error codes for customers, which are displayed automatically when errors occur, and error codes, which show the error history in the test mode during servicing. For details on how to view error codes for the customer, refer to the following box in the instruction manual. For details on how to check error codes during servicing, refer to the following “Procedure for using the Self-Diagnosis Function (Error History Display Mode)”.
PAGE 3
HCD-C5 TABLE OF CONTENTS SELF-DIAGNOSIS FUNCTION ..................................... 2 1. SERVICING NOTES ............................................... 4 2. GENERAL ................................................................... 7 3. DISASSEMBLY ......................................................... 9 4. TEST MODE ............................................................... 24 5. ELECTRICAL ADJUSTMENTS CD Section ......................................................................
PAGE 4
HCD-C5 SECTION 1 SERVICING NOTE NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.
PAGE 5
HCD-C5 SERVICE POSITION OF THE CD MECHANISM DECK CD MECHANISM DECK (TN-CCD1001Z) UCOM BOARD BD (CD) BOARD CN101 STAND CN204 SERVICE POSITION OF THE MD MECHANISM DECK UCOM BOARD BD (CD) BOARD CN203 CN204 CN101 CN201 PANEL BOARD CN102 CN703 CN702 CN201 AUDIO BOARD CN701 MD DIGITAL BOARD CN601 CN103 CN102 BD (MD) BOARD MD MECHANISM (MDM-7B4M) 5
PAGE 6
HCD-C5 JIG FOR CHECKING BD (MD) BOARD WAVEFORM The special jig (J-2501-196-A) is useful for checking the waveform of the BD (MD) board. The names of terminals and the checking items to be performed are shown as follows.
PAGE 7
HCD-C5 SECTION 2 GENERAL This section is extracted from instruction manual. Parts Identification The items are arranged in alphabetical order. Refer to the pages indicated in parentheses () for details.
PAGE 8
HCD-C5 Remote control Parts Identification 12 34 5 6 wk 7 8 9 0 qa qs qd wj wh wg wf wd ws wa qf qg w; qlqkqjqh CD x qh (10) CD X ws (10) CD N wd (9, 11, 20) CLEAR 9 (11, 16, 28, 38) CLOCK/TIMER SELECT 6 (41, 42) CLOCK/TIMER SET 7 (8, 40, 41) CURSOR T/t wh (8, 13, 28) DBFB qf (39) DISPLAY wk (8, 12, 17, 38) ENTER/YES 8 (8, 11, 13, 14, 16, 21–36, 38, 40–42) FM MODE qj (37) FUNCTION w; (9, 11, 13, 14, 16, 19, 21–37, 44) Letter/Number buttons wj (10, 13, 15, 16, 27, 28, 37) MD x qs (15) MD X wf (15)
PAGE 9
HCD-C5 SECTION 3 DISASSEMBLY • This set can be disassembled in the order shown below. • The dotted square with arrow ( →) prompts you to move to the next job when all of the works within the dotted square ( completed. ) are SET BOTTOM PLATE, CASE (Page 10) JACK BOARD, HP BOARD, REAR COVER (Page 18) TUNER PACK, D. C.
PAGE 10
HCD-C5 Note: Follow the disassembly procedure in the numerical order given. 3-1. BOTTOM PLATE, CASE 6 case 5 claw A 4 screw (+BVTT 3 x 5) 3 bottom plate A 2 three screws (+BVTT 3 x 5) 1 four screws (+BVTT 3 x 5) 3-2.
PAGE 11
HCD-C5 3-3. CD MECHANISM DECK (TN-CCD1001Z), BD (CD) BOARD qs cushion (A) CN1 qd CD mechanism deck (TN-CCD1001Z) 7 board to board connector q; screw (+BVTT 2 x 5) qa bracket (CD), foot (felt) 9 two screws (+BVTT 2.
PAGE 12
HCD-C5 3-4. CONNECTOR BOARD 6 screw (+P 2 x 2.5) 5 FPC holder 7 wire clamper 8 CONNECTOR board 1 Remove solderings starting from the left LOADING (+), (–), red and black. 3 Remove solderings starting from the top left SPINDLE (+), (–), FD MOTOR (+), (–) and the LIMIT switch that has no polarity. 2 Remove solderings starting from the left green, yellow, orange, red and brown. 12 4 Remove the soldering.
PAGE 13
HCD-C5 3-5. FRONT BRACKET SECTION, LOADING MOTOR ASSY (M902) 8 Remove it in the direction of the arrow A from the left side when viewed from the rear of the front bracket. 5 Remove the two hang-up springs (FZ). 7 screw (M 2 x 4) A 2 screw (M 2 x 2.5) 1 FPC holder 6 screw (+P 2 x 3) 4 Raise the CONNECTOR board. 3 three claws Note during re-assembling 3 Move down the gear mount bracket in the direction of the arrow B. 1 wire clamper When re-assembling, align the positions as shown.
PAGE 14
HCD-C5 3-6. SW BOARD 3 2 Release it from the detents. 1 eleven claws 2 switch (S3) (Disc Existence, Chucking, Releasing detect) 1 Remove two solderings. (BRN) q; SW board (RED) (ORG) 5 Remove two solderings. (YEL) (GRN) 3 Remove two solderings. 4 switch (S2) (12cm Disc/12cm Disc Eject End detect) 9 Remove five solderings. 6 switch (S1) (Disc IN/8cm Disc detect) 8 switch (S4) (8cm Disc Eject End detect) 7 Remove two solderings.
PAGE 15
HCD-C5 3-7. FEED MOTOR ASSY (M903) 7 feed motor assy (M903) 1 two screws (+P 2 x 10) 4 pulley gear 3 6 FD gear bracket 2 Remove the soldering. 5 screw (+P 2 x 3.0) 3-8. REAR DAMPER BRACKET 5 rear damper bracket 2 screw (+P 2 x 2.
PAGE 16
HCD-C5 3-9. OPTICAL PICK-UP (OPTIMA-720L1E), SCREW GUIDE, FEED SCREW ASSY, etc. 4 screw (+P 2 x 10) 6 optical pick-up (OPTIMA-720L1E), screw guide, feed screw assy, etc. 2 two screws (+P 2 x 10) 1 pick-up flexible board 5 Slant the CONNECTOR board in the direction of the arrow A. A 3 feed motor assy (M903), FD gear bracket, etc. 3-10. OPTICAL PICK-UP (OPTIMA-720L1E) 2 screw (+P 1.
PAGE 17
HCD-C5 3-11. BASE SECTION 5 two screws (+P2 x 5) 4 Remove solderings from the damper pins. 1 pick-up flexible board 2 Remove the two hang-up springs (FZ) as shown. 1 Move the holder (L) in the direction of the arrow A. 2 Remove the two damper pins toward inside. A B 3 Remove the two hang-up springs (R) as shown. 3 Slant the base block in the direction of the arrow B and remove the base block from the main unit in a manner that the lock pin passes through the groove of the holder (L) as shown.
PAGE 18
HCD-C5 3-12. SPINDLE MOTOR ASSY (M904) 3 open to direction of the arrow A 2 clip arm spring 4 two screws (+P 1.7 x 2.2) A 5 turn table 1 clip arm spring (L) 6 washer 7 spindle motor 8 spindle motor assy (M904) 3-13. JACK BOARD, HP BOARD, REAR COVER 4 screw (+PTPWH 3 x 8) 8 two screws (+B 4 x 16) 7 HP board 6 connector (CN110) 1 screw (+BVTT 3 x 5) 5 connector (CN109) 2 four screws (+BV 3 x 12) D.C.
PAGE 19
HCD-C5 3-14. TUNER PACK, D. C. FAN (M901) Note for re-installation 2 wire (flat type) (11 core or 15 core) When installing the tuner pack, insert the three harnesses connected to CN105 and connected to CN106 and connected to CN108 of the AUDIO board, in between the flat cable (11 core or 15 core) and the tuner pack in the direction of the arrow so that the flat cable (11 core or 15 core) must be inserted. 4 connector (CN105) 5 D.C. fan (M901) CN108 D.C.
PAGE 20
HCD-C5 3-16. AUDIO BOARD, POWER BOARD, POWER TRANSFORMER (T900) (1) 6 AUDIO board, POWER boad, power transformer (T900 ), etc. 1 two screws (+BVTT 3 x 5) 5 connector (CN102) 2 screw (+BV 3 x 8) 4 two screws (+BVTT 3 x 5) 3 four screws (+BVTT 3 x 5) 3-17. AUDIO BOARD, POWER BOARD, POWER TRANSFORMER (T900) (2) qs insulated plates (POWER) qa nylon rivet (DIA 3.5) qd insulated plates (POWER) 2 q; D.C.
PAGE 21
HCD-C5 3-18. MD MECHANISM DECK (MDM-7B4M), MD DIGITAL BOARD 7 two screws (+BVTT 3 x 5) 4 shield (MD2) 2 two screws (+BVTT 3 x 5) 8 MD DIGITAL board 1 four screws (+BVTT 3 x 5) 3 ground wire q; four screws, step 9 shield (MD1) Slant the shield (MD1), shield (MD2) and the MD DIGITAL board in the direction of the arrow and remove the two 2 screws (+BVTT 3 x 5). 5 wire (flat type) (17 core) (CN703) qa four insulators 6 wire (flat type) (27 core) (CN702) qs screw (+BTN 1.
PAGE 22
HCD-C5 3-20. BD (MD) BOARD 2 Remove two solderings. (spindle) 1 Remove two solderings. (sled) M702 M701 M703 6 flexible board (CN101) 3 Remove two solderings. (loading) S102 4 Remove three solderings. 7 connector (CN104) 5 two screws (+BP TRI 2 x 6 CZN) 8 BD (MD) board 3-21. LOADING MOTOR (M703), SPINDLE MOTOR (M701), SLED MOTOR (M702) 3 torsion spring (spindle) 1 lever (head) 2 belt (loading) 4 two screws (+PWH 1.7 x 3.5) 8 two screws (+PWH 1.7 x 3.
PAGE 23
HCD-C5 3-22. OVER WRITE HEAD 1 screw (+P 1.7 x 6) 2 over write hrad (HR901) 3-23.
PAGE 24
HCD-C5 SECTION 4 TEST MODE [Factory Preset Mode] ∗ This mode clears all data including preset data stored in the RAM to initial conditions. Excute this mode when returning the set to the customer. Procedure: 1. Press the ?/1 button to turn the power on. 2. Press the FUNCTION z button to set the CD function. (except the TUNER function) 3. Press three buttons VOL + , CD Z and MD Z simultaneously. 4. The message “COLD RESET” blinks and the present contents are reset to the default values.
PAGE 25
HCD-C5 [CD Aging Mode] Procedure: 1. Press the ?/1 button to turn the power on. 2. Press the FUNCTION z button to set the CD function, and insert a disc. 3. Press three buttons of VOL - , CD Z and >/M TUNING + simultaneusly. 4. The message “Eject” is displayed, a disc is ejected and inserted again automatically. 5. The sequence during the CD aging mode is following as below.
PAGE 26
HCD-C5 4. BASIC OPERATIONS OF THE TEST MODE All operations are performed using the . “R” , > “R” , ENTER/YES “R” and MENU/NO “R” . The functions of these buttons are as follows. Function name Function . “R” , > “R” buttons Changes parameters and modes ENTER/YES “R” button Proceeds onto the next step. Finalizes input MENU/NO “R” button Returns to previous step. Stops operations 5. SELECTING THE TEST MODE There are 26 types of test modes as shown below. The groups can be switched by pressing the .
PAGE 27
HCD-C5 5-1. Operating the Continuous Playback Mode 1. Entering the continuous playback mode (1) Set the disc in the unit. (Whichever recordable discs or discs for playback only are available) (2) Press the . “R” or > “R” button to display “CPLAY1MODE” (C34). (3) Press the ENTER/YES “R” button to change the display to “CPLAY1MID”. (4) When access completes, the display changes to “C = AD = )”. Note: The numbers “ ” displayed show you error rates and ADER. 2.
PAGE 28
HCD-C5 6. FUNCTIONS OF OTHER BUTTONS Function Contents u Sets continuous playback when this is pressed in the STOP state. When this is pressed during continuous playback, playback position moves.
PAGE 29
HCD-C5 IOP DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC195 OF BD (MD) BOARD) ARE REPLACED The IOP value labeled on the optical pick-up can be recorded in the non-volatile memory. By recording the value, it will eliminate the need to look at the value on the label of the optical pick-up. When replacing the optical pick-up or non-volatile memory (IC195 of BD (MD) board), record the IOP value on the optical pick-up according to the following procedure. Record Procedure: 1.
PAGE 30
HCD-C5 CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS IN MD Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent. Details of the procedures are described in “5 Electrical Adjustments”. Criteria for Determination (Unsatisfactory if specified value is not satisfied) Laser power check (6-2 : See page 37) Measure if unsatisfactory • 0.9 mW power Specified value : figure1 • 7.
PAGE 31
HCD-C5 Fig. 1 Reading the Test Mode Display (During recording and stop) Fig. 2 Reading the Test Mode Display (During playback) RTs@@c##e** fluorescent indicator tube @@ ###** $$ fluorescent indicator tube @@ : ## : ** : $$ : @@ : Cause of retry ## : Number of retries ** : Number of retry errors Parts No.
PAGE 32
HCD-C5 Reading the Retry Cause Display Hexadecimal 8 Bit b7 Binary 0 0 0 0 0 0 0 1 Higher Bit 4 2 1 b6 b5 b4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 0 1 0 0 0 0 0 8 b3 0 0 0 1 0 0 0 0 Lower Bits Details 4 2 1 Hexadecimal b2 b1 b0 When 0 When 1 0 0 1 01 Emphasis OFF Emphasis ON 0 1 0 02 Monaural Stereo 1 0 0 04 This is 2-bit display. Normally 01. 0 0 0 08 01:Normal audio.
PAGE 33
HCD-C5 SECTION 5 ELECTRICAL ADJUSTMENTS Checking Location: CD SECTION Note 1: 1. CD Block is basically designed to operate without adjustment. Therefore, check each item in order given. 2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated. 3. Use an oscilloscope with more than 10MΩ impedance. 4. Clean the object lens by an applicator with neutral detergent when the signal level is low than specified value with the following checks.
PAGE 34
HCD-C5 MD SECTION Note 1: About “R” As this unit has only a few buttons, some operations require the use of remote commander (RM-SC5BEN/provided with unit: 1-476-649-11) buttons. These operations are indicated as “R” in this manual. Example: MENU/NO “R” ...Press the MENU/NO button of the remote commander. Note 2: Incorrect operations may be performed if the MD test mode is not entered properly. In this case, press the ?/1 button to turn the power off, and retry to enter the MD test mode. 1.
PAGE 35
HCD-C5 Adjustment flow • Abbreviation OP: optical pick-up Start Replace IC195 YES After turning off and then on the power, initialize the EEPROM For details, refer to “WHEN MEMORY NG IS DISPLAYED” in Section 4. TEST MODE (See page 29) NO Replace OP or IC195 YES 7. INITIAL SETTING OF ADJUSTMENT VALUE (See page 40) YES 9. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT (See page 40) NO Replace IC101, IC195, or D101 NO Replace OP, IC190, or IC195 YES 10.
PAGE 36
HCD-C5 2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSION To check the emission of the laser diode during adjustments, never view directly from the top as this may lose your eye-sight. 3. PRECAUTIONS FOR USE OF OPTICAL PICK-UP (KMS-260B/260E) As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when handling it. Before disconnecting the connector, solder first. Before connecting the connector, be careful not to remove the solder.
PAGE 37
HCD-C5 5. USING THE CONTINUOUSLY RECORDED DISC * This disc is used in focus bias adjustment and error rate check. The following describes how to create a continuous recording disc. 1. Insert a disc (blank disc) commercially available. 2. Press the . “R” or > “R” button and display “CREC 1MODE” (C35). 3. Press the ENTER/YES “R” button again to display “CREC 1 MID”. Display “CREC 1(0300)” and start to recording. 4. Complete recording within 5 minutes. 5. Press the MENU/NO “R” button and stop recording . 6.
PAGE 38
HCD-C5 6-4. Auto Check This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up. To perform this test mode, the laser power must first be checked. Perform Auto Check after the laser power check and Iop compare. Procedure: 1. Press the . “R” or > “R” button to display “AUTO CHECK” (C01). 2. Press the ENTER/YES “R” button. If “LDPWR ” is displayed, it means that the laser power check has not been performed.
PAGE 39
HCD-C5 9. Press the ENTER/YES “R” button to display “EFB = MOP”. Then, the optical pick-up moves to the pit area automatically and servo is imposed. 10. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not press the . “R” or > “R” button. Traverse Waveform A VC B 6. Press the ENTER/YES “R” button to display “ / c= ”.
PAGE 40
HCD-C5 7. INITIAL SETTING OF ADJUSTMENT VALUE Note: Mode which sets the adjustment results recorded in the non-volatile memory to the initial setting value. However the results of the temperature compensation offset adjustment will not change to the initial setting value. If initial setting is performed, perform all adjustments again excluding the temperature compensation offset adjustment. For details of the initial setting, refer to “4.
PAGE 41
HCD-C5 6. Press the . “R” or > “R” button so that the reading of the laser power meter becomes the specified value, press the ENTER/YES “R” button to save it. SPECIFIED VALUE KMS-260B KMS-260E 6.9 to 7.1 mW 7.2 to 7.3 mW Note: Do not perform the emission with 8.4 mW more than 15 seconds continuously. The method of identifying the optical pick-up (KMS-260B/260E) UV adhesive agent = Pink : KMS-260B White : KMS-260E UV adhesive agent 7. Then, press the .
PAGE 42
HCD-C5 Procedure: 1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin 6 (VC) on the BD (MD) board. 2. Load a disc (any available on the market). (Refer to Note 1) 3. Press the M “R” button to move the optical pick-up outside the pit. 4. Press the . “R” or > “R” button to display “EF MO ADJUST” (C07). 5. Press the ENTER/YES “R” button to display “EFB = MOR”. (Laser power READ power/Focus servo ON/tracking servo OFF/spindle (S) servo ON) 6. Press the .
PAGE 43
HCD-C5 13. FOCUS BIAS ADJUSTMENT 14. ERROR RATE CHECK Procedure: 1. Load the continuously-recorded disc. (Refer to “5. USING THE CONTINUOUSLY RECORDED DISC” (See page 37)) 2. Press the . “R” or > “R” button to display “CPLAY 1 MODE” (C34). 3. Press the ENTER/YES “R” button to display “CPLAY 1MID”. 4. Press the MENU/NO “R” button when “C = = ” is displayed. 5. Press the . “R” or > “R” button to display “FBIAS ADJUST” (C09). 6. Press the ENTER/YES “R” button to display “ / a= T”.
PAGE 44
HCD-C5 16. AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT Be sure to perform this adjustment when the optical pick-up is replaced. If the adjustment results becomes “Adjust NG!”, the optical pick-up may be faulty or the servo system circuits may be abnormal. 16-1. CD Auto Gain Control Output Level Adjustment Procedure: 1. Load the check disc (TDYS-1). 2. Press the . m “R” or M > “R” button to display “AG Set (CD)” (C11). 3.
PAGE 45
HCD-C5 Ver 1.1 2001.09 SECTION 6 DIAGRAMS • Circuit Boards Location 6-1. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS (In addition to this, the necessary note is printed in each block) Note on Printed Wiring Boards: • X : parts extracted from the component side. a : Through hole. • • Y : parts extracted from the conductor side. • b : Pattern from the side which enables seeing.
PAGE 46
HCD-C5 6-2.
PAGE 47
HCD-C5 6-3. BLOCK DIAGRAM – MD SERVO SECTION – 15 TX 54 I 12 BUP+3.
PAGE 48
HCD-C5 6-4. BLOCK DIAGRAM – MAIN SECTION – MD-L MD SERVO SECTION (Page 47) C IC301 SOUND PROCESSOR REC-L REC 35 OUT 25 5 Q331 MUTING 38 TC Q311 DBFB SWITCH R-CH IN B-O 26 J101 A-MUTE 8 L RELAY 2 • Signal Path SPEAKER : FM : CD(ANALOG) 6 – : REC(MD) J103 PHONES R-CH + 7 : PB(TAPE) : REC(TAPE) Q341 MUTING D343 Q232 H/P DETECT A-MUTE B-I 27 R-CH CN208 : PB(MD) TAPE OUT 3 IC302 HEADPHONE AMP 37 CD/MD J102 • R-CH is omitted due to same as L-CH.
PAGE 49
HCD-C5 6-5. PRINTED WIRING BOARDS – CD SECTION – • See page 45 for Circuit Boards Location. SW BOARD GRN YEL • Semiconductor Location ORG RED BRN S4 (8cm Disc Eject End Detect) Ref. No. S1 (Disc IN/8cm Disc Detect) S3 (Disc Existence, Chacking, Releasing Detect) S2 (12cm Disc/12cm Disc Eject End Detect) IC103 IC102 1-682-099- IC1102 + CONNECTOR BOARD M902 LOADING MOTOR GRN YEL ORG RED BRN 14 CN1 26 RFAC 13 1 DVC1.
PAGE 50
HCD-C5 6-6. SCHEMATIC DIAGRAM – CD SECTION – • See page 45 for Wavefoms. • See page 64 for IC Pin Function Description.
PAGE 51
HCD-C5 6-7. PRINTED WIRING BOARD – BD (MD) BOARD – • See page 45 for Circuit Boards Location. BD (MD) BOARD (SIDE A) OPTICAL PICK - UP BLOCK (KMS-260E/Z-NP) BD (MD) BOARD (SIDE B) • Semiconductor Location Side A S102 PROTECT Ref. No. Location REFLECT M703 IC101 D101 A-1 Q101 Q131 Q132 Q133 Q134 B-1 B-1 B-1 B-1 B-1 E • Semiconductor Location Side B M701 E Ref. No.
PAGE 52
HCD-C5 6-8. SCHEMATIC DIAGRAM – BD (MD) BOARD (1/2) – • See page 45 for Wavefoms. • See page 65 for IC Block Diagrams. • See page 68 for IC Pin Function Description.
PAGE 53
HCD-C5 6-9. SCHEMATIC DIAGRAM – BD (MD) BOARD (2/2) – • See page 45 for Wavefoms. • See page 69 for IC Pin Function Description.
PAGE 54
HCD-C5 6-10. PRINTED WIRING BOARD – MD DIGITAL BOARD – • See page 45 for Circuit Boards Location. (Page 58) • Semiconductor Location Ref. No.
PAGE 55
HCD-C5 6-11. SCHEMATIC DIAGRAM – MD DIGITAL BOARD – • See page 45 for Wavefoms. • See page 65, 66 for IC Block Diagrams. • See page 72 for IC Pin Function Description.
PAGE 56
HCD-C5 Ver 1.1 2001.09 6-12. PRINTED WIRING BOARD – UCOM BOARD – • See page 45 for Circuit Boards Location. • Semiconductor Location Ref. No. (Page 54) IC221 DIGITAL OPTICAL INPUT IC222 Location D214 D221 D222 D232 D513 D910 D923 D924 D925 D926 D927 D941 D942 D943 B-1 C-9 B-9 D-1 B-9 D-3 B-3 B-3 D-4 D-4 D-4 D-4 D-4 D-5 IC212 C-3 Ref. No.
PAGE 57
HCD-C5 Ver 1.1 2001.09 6-13. SCHEMATIC DIAGRAM – UCOM BOARD – • See page 45 for Wavefoms. • See page 67 for IC Block Diagrams. • See page 74 for IC Pin Function Description. (Page 50) (Page 59) (Page 55) (AEP,UK) R538 10k IC B/D (HK,KR,AUS) (Page 61) DIGITAL OPTICAL INPUT (Page 59) D232 ISS355 TE-17 1000 6.3V FB537 BLM21B102S 470 1/16W SPEAKER C241 4.
PAGE 58
HCD-C5 Ver 1.1 2001.09 6-14. PRINTED WIRING BOARDS – AUDIO SECTION – • See page 45 for Circuit Boards Location. • Semiconductor Location Ref. No. Location D101 D111 D301 D103 D343 D393 B-6 D-5 C-4 B-6 B-5 B-5 IC301 IC302 B-2 B-4 Ref. No.
PAGE 59
HCD-C5 Ver 1.1 2001.09 6-15. SCHEMATIC DIAGRAM – AUDIO SECTION – • See page 64 for IC Block Diagrams. OUT TAPE (Page 55) IN B (AEP,UK,KR) (Page 63) +5V FM SIGNAL OUT RDS INT RDS DATA R111 330 RDS INT RDS DATA C111 10 10V D111 MTZJ-T-77-5.
PAGE 60
HCD-C5 6-16. PRINTED WIRING BOARD – PANEL BOARD – • See page 45 for Circuit Boards Location. • Semiconductor Location Ref. No.
PAGE 61
HCD-C5 6-17. SCHEMATIC DIAGRAM – PANEL BOARD – • See page 67 for IC Block Diagrams.
PAGE 62
HCD-C5 6-18. PRINTED WIRING BOARDS – POWER SECTION – • See page 45 for Circuit Boards Location. (Page 56) IC901 (Page 56) IC902 T900 MAIN TRANSFORMER IC903 IC904 • Semiconductor Location Ref. No. SUB TRANSFORMER IC906 B IC905 (Page 58) EB902 12 EB901 IC907 12 62 62 D906 D921 D961 D962 D963 D964 D971 D972 D973 D974 D975 D976 D981 D982 D983 D984 Location D-4 E-5 D-3 D-3 D-3 D-3 A-2 B-2 A-2 B-2 A-2 A-1 A-5 A-3 A-3 A-2 Ref. No.
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HCD-C5 Ver 1.1 2001.09 6-19. SCHEMATIC DIAGRAM – POWER SECTION – T4AL/250V T4AL/250V (Page 57) B (Page 59) (Page 57) 1.
PAGE 64
HCD-C5 6-20.
PAGE 65
HCD-C5 IC1102 BA6956AN (BD (CD) BOARD) IC871 BA6956AN (MD DIGITAL BOARD) IC201 µDA1360TS (MD DIGITAL BOARD) TSD 16 VDDA 15 VSSA VINL 1 – + CONTROL LOGIC 2 3 4 5 6 7 8 9 VREF OUT2 RNF OUT1 VM VCC FIN GND RIN VREF 2 1 CLOCK CONTROL ADC ( ) DECIMATION FILTER VINR 3 – + VREF (N) 4 VREF (P) 5 ADC ( ) 14 FSEL DCCANCELLATION FILTER DIGITAL INTERFACE 13 DATAO 12 WS 11 BCK 10 VSSD SFOR 6 PWON 7 SYSCLK 8 9 VDDD CAPA– CAPA+ IN2R IN2F VM2 OUT2F PGND2 OUT2R VM12 OUT1R PGND1
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HCD-C5 RTCB VDDD PREEM0 NC NC TEST2 NC WSO DATAO SELSTATIC TEST1 IC211 µDA1350AH (MD DIGITAL BOARD) 44 43 42 41 40 39 38 37 36 35 34 RESET 1 33 BCKO VDDD (C) 2 VSSD 3 VSSD (C) 4 L3DATA 5 L3CLOCK 6 32 VDDA (PLL) 31 VSSA (PLL) L3 INTERFACE 30 PREEM1 DATA OUTPUT INTERFACE IEC 958 DECODER DATAI 7 CLOCK AND TIMING CIRCUIT DATA INPUT INTERFACE BCKI 8 WSI 9 L3MODE 10 AUDIO FEATURE PROCESSOR INTERPOLATOR NOISE SHAPER NC 11 SPDIF0 SPDIF1 VDDA (DAC) 18 19 20 IC861 M62016L (MD DIGIT
PAGE 67
HCD-C5 IC601 M66004M8FP-200D (PANEL BOARD) DIG11 1 | | DIG0 12 64 DIG12 | | 61 DIG15 DIGITAL OUTPUT CIRCUIT RES 13 INDICATION CONTROLLER SERIAL RECEIVE CIRCUIT P1 17 P0 18 VCC1 19 XOUT 20 XIN 21 VSS 22 OUTPUT PORT (2BIT) INDICATION CONTROL RESISTOR CLOCK GENERATOR CIRCUIT CODE/COMMAND CONTROL CIRCUIT CODE SELECT CS 14 CLK 15 DATA 16 RAM WRITE INDICATION CODE RESISTOR (8BIT x 16) (35BIT x 16) DECODER DECODER (35BIT x 16) CODE WRITE 60 VCC2 SEG35 23 | | SEG27 31 59 SEG0 | | 33 SEG26 SEG
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HCD-C5 6-21. IC PIN FUNCTION DESCRIPTION • IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP) (BD (MD) BOARD) Pin No. Pin Name I/O Description 1 I I I-V converted RF signal I input from the optical pick-up block detector 2 J I I-V converted RF signal J input from the optical pick-up block detector 3 VC O Middle point voltage (+1.
PAGE 69
HCD-C5 • IC151 CXD2662R • (DIGITAL SIGNAL PROCESSOR, EFM/ACIRC ENCODER/DECODER, SHOCK PROOF MEMORY CONTROLLER, ATRAC ENCODER/DECODER) (BD (MD) BOARD) Pin No.
PAGE 70
HCD-C5 Pin No.
PAGE 71
HCD-C5 Pin No. Pin Name I/O Description 94 SPFD O 95 FGIN I (S) 96 TEST1 I 97 TEST2 I 98 TEST3 I 99 DVSS — Ground terminal (digital system) 100 EFMO O EFM signal output terminal when recording mode Spindle servo drive PWM signal (+) output to the BH6511FS (IC141) Input terminal for the test (fixed at “L”) * I (S) stands for schmitt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O.
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HCD-C5 • IC701 M30803MG-A03FP MASTER CONTROLLER (MD DIGITAL BOARD) Pin No.
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HCD-C5 Pin No.
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HCD-C5 • IC501 µPD703032AYGF-M01-3BA MASTER CONTROL (UCOM BOARD) Pin No.
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HCD-C5 Pin No.
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HCD-C5 Ver 1.1 2001.09 SECTION 7 EXPLODED VIEWS NOTE: • -XX, -X mean standardized parts, so they may have some differences from the original one. • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded views are not supplied. • Hardware (# mark) list and accessories and packing materials are given in the last of this parts list.
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HCD-C5 7-2. FRONT PANEL SECTION 51 56 not supplied #9 not supplied #10 #9 55 #9 54 57 58 not supplied not supplied 53 Ref. No. 51 52 53 54 Part No. Description X-4953-691-1 4-942-636-01 4-233-846-01 4-233-847-01 PANEL ASSY (B), FRONT EMBLEM (NO.3.5), SONY ESCUTCHEON (MD) ESCUTCHEON (CD) 52 Remarks Ref. No. 55 56 57 58 Part No.
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HCD-C5 Ver 1.1 2001.09 7-3. CHASSIS SECTION-1 102 104 111 112 103 114 105 101 106 107 d #1 108 M901 109 not supplied #1 110 T900 113 d #1 Ref. No. Part No. Description 101 101 102 103 0 104 A-4476-947-A A-4727-413-A 1-681-380-11 3-703-244-00 1-696-847-11 UCOM BOARD, COMPLETE (AEP,UK) UCOM BOARD, COMPLETE (AUS, HK.
PAGE 79
HCD-C5 7-4. CHASSIS SECTION-2 not supplied #1 156 #1 157 155 154 #1 not supplied 152 151 MDM-7B4M 158 not supplied not supplied Ref. No. 151 152 154 Part No. Description 4-231-555-01 INSULATOR 4-228-643-21 SCREW (+BVTTWH M3), STEP 1-773-138-11 WIRE (FLAT TYPE) (19 CORE) Remarks Ref. No. 155 156 157 158 Part No. Description A-4725-732-A 1-757-079-11 1-757-080-11 4-231-113-01 MD DIGITAL BOARD, COMPLETE WIRE (FLAT TYPE) (17 CORE) WIRE (FLAT TYPE) (27 CORE) SCREW (1.
PAGE 80
HCD-C5 7-5. CD MECHANISM DECK SECTION (TN-CCD1001Z) 405 not supplied #11 #11 404 404 #11 not supplied chassis section #12 front bracket section 406 #12 #13 403 M902 #11 407 not supplied 401 #14 a 409 base section 401 a 408 402 402 Ref. No. 401 402 403 404 405 80 Part No. Description 4-236-062-01 4-236-087-01 4-236-114-01 4-236-088-01 4-236-101-01 PIN, DAMPER SPRING (FZ), HANG UP BELT, LOADING SPRING (R), HANG UP DAMPER (J) Remarks Ref. No. 406 407 408 409 M902 Part No.
PAGE 81
HCD-C5 7-6. CD MECHANISM DECK SECTI – FRONT BRACKET SECTION (TN-CCD1001Z) not supplied not supplied 460 not supplied 458 461 459 462 458 455 454 457 456 453 #11 not supplied 452 451 not supplied Ref. No. Part No. Description 451 452 453 454 455 4-236-112-01 4-236-115-01 4-236-111-01 4-236-106-01 4-236-108-01 SPRING (R), LOADING PULLEY BRACKET (J), FRONT SPRING (L), LOADING PULLEY BRACKET, GEAR MOUNT GEAR (3), LOADING 456 4-236-107-01 GEAR (2), LOADING Remarks Ref. No. Part No.
PAGE 82
HCD-C5 7-7. CD MECHANISM DECK SECTION – BASE SECTION (TN-CCD1001Z) #15 511 #19 513 510 not supplied 509 not supplied 512 514 507 508 515 not supplied e 507 #17 516 #18 M904 M903 506 S5 505 e 517 518 #17 503 504 #17 #16 #17 519 502 #13 501 #20 Ref. No. Part No.
PAGE 83
HCD-C5 7-8. CD MECHANISM DECK SECTION – CHASSIS SECTION (TN-CCD1001Z) #11 not supplied 565 561 562 564 563 566 567 554 560 S3 S2 568 559 558 S1 569 S4 555 554 553 557 552 556 Ref. No. 551 Part No. Description Part No. Description 551 552 553 554 555 4-236-085-01 4-236-086-01 4-236-073-01 4-236-074-01 4-236-064-01 ARM, SLIDE SPRING, SLIDE ARM ARM (R), S SPRING, S ARM HOLDER, S ARM Remarks Ref. No.
PAGE 84
HCD-C5 7-9. MD MECHANISM DECK SECTION-1 (MDM-7B4M) 721 711 not supplied 714 710 713 not supplied 715 716 #21 707 717 not supplied 705 708 718 719 707 704 not supplied 702 706 720 703 702 701 Ref. No. Part No.
PAGE 85
HCD-C5 7-10. MD MECHANISM DECK SECTION-2 – (MDM-7B4M) 761 HR901 760 762 763 765 764 759 #22 756 #22 758 761 752 756 757 766 752 751 751 S102 M701 754 753 767 755 M702 752 752 M703 768 751 Ref. No. Part No. Description 751 752 753 754 755 4-231-319-01 3-372-761-01 4-227-008-01 4-227-009-01 4-226-989-01 SCREW (2X6) CZN, +B (P) TRI SCREW (M1.7), TAPPING GEAR (SC) GEAR (SD) CHASSIS 756 757 758 759 0 760 4-232-270-01 4-226-993-01 4-227-014-01 1-678-514-11 A-4672-541-A SCREW (1.
PAGE 86
HCD-C5 Ver 1.1 2001.09 AMP SECTION 8 ELECTRICAL PARTS LIST AUDIO NOTE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. • -XX, -X mean standardized parts, so they may have some difference from the original one. • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • CAPACITORS: uF: µF Ref. No. Part No.
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HCD-C5 Ver 1.1 2001.09 AUDIO Ref. No. CN105 ∗ CN106 ∗ CN108 Part No. 1-564-506-11 1-568-934-11 1-568-943-11 Description PLUG, CONNECTOR 3P PIN, CONNECTOR 7P PIN, CONNECTOR 5P Remarks < DIODE > D101 D103 D111 D301 D343 8-719-200-82 8-719-988-61 8-719-923-34 8-719-988-61 8-719-988-61 DIODE DIODE DIODE DIODE DIODE 11ES2-TA1B 1SS355TE-17 MTZJ-T-77-5.
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HCD-C5 BD (CD) Ref. No. Part No. Description C113 C114 C115 C117 C118 1-124-584-00 1-162-964-11 1-124-589-11 1-164-360-11 1-115-156-11 ELECT CERAMIC CHIP ELECT CERAMIC CHIP CERAMIC CHIP 100uF 0.001uF 47uF 0.1uF 1uF Remarks C119 C120 C154 C159 C161 1-115-156-11 1-126-513-11 1-164-360-11 1-162-968-11 1-164-360-11 CERAMIC CHIP ELECT CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 1uF 10V 47uF 20.00% 6.3V 0.1uF 16V 0.0047uF 10% 50V 0.
PAGE 89
HCD-C5 BD (CD) Ref. No. Part No. Description Part No. Description R196 R197 R198 R199 R201 1-216-839-11 1-216-839-11 1-216-839-11 1-216-839-11 1-216-839-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 33K 33K 33K 33K 33K 5% 5% 5% 5% 5% Remarks 1/16W 1/16W 1/16W 1/16W 1/16W C111 C112 C113 C114 C115 1-117-720-11 1-110-563-11 1-162-968-11 1-125-837-11 1-162-966-11 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 4.7uF 0.068uF 0.0047uF 1uF 0.
PAGE 90
HCD-C5 BD (MD) Ref. No. Part No.
PAGE 91
HCD-C5 Ver 1.1 2001.09 BD (MD) Ref. No. CONNECTOR Part No. Description R183 R184 R185 R195 R196 1-216-841-11 1-220-942-11 1-220-942-11 1-216-833-11 1-216-833-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 47K 3.3 3.3 10K 10K 5% 1% 1% 5% 5% Remarks 1/16W 1/4 1/4 1/16W 1/16W Ref. No. ∗ CN107 R197 R218 1-216-833-11 METAL CHIP 1-216-864-11 METAL CHIP 10K 0 5% 5% 1/16W 1/16W J101 J102 HP Part No.
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HCD-C5 MD DIGITAL Ref. No. PANEL Part No. Description Part No. Description C843 C861 C862 C863 C864 1-164-156-11 1-164-156-11 1-115-869-11 1-164-156-11 1-162-970-11 CERAMIC CHIP CERAMIC CHIP ELECT CERAMIC CHIP CERAMIC CHIP 0.1uF 0.1uF 0.33uF 0.1uF 0.01uF Remarks 25V 25V 20.00% 50V 25V 10% 25V R220 R221 R222 R223 R701 1-216-817-11 1-216-809-11 1-216-825-11 1-216-833-11 1-216-817-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 470 100 2.
PAGE 93
HCD-C5 Ver 1.1 2001.09 PANEL Ref. No. Remarks Part No. Description Part No. Description C655 C656 C657 C658 C659 1-162-286-31 1-162-286-31 1-162-286-31 1-162-286-31 1-162-286-31 CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC 220PF 220PF 220PF 220PF 220PF 10.00% 10.00% 10.00% 10.00% 10.
PAGE 94
HCD-C5 Ver 1.1 2001.09 POWER Ref. No. SW Part No. UCOM Description Remarks < CONNECTOR > ∗ CN901 CN902 CN991 ∗ CN992 ∗ CN995 1-770-732-11 1-778-241-11 1-564-321-00 1-564-321-21 1-564-511-11 CONNECTOR, BOARD TO BOARD 15P CONNECTOR, BOARD TO BOARD 5P PIN, CONNECTOR 2P PIN, CONNECTOR 2P PLUG, CONNECTOR 8P Ref. No. Part No. Description 0 R981 0 R982 R991 R992 R993 1-219-120-81 1-240-877-11 1-249-429-11 1-216-833-11 1-249-413-11 FUSIBLE FUSIBLE CARBON METAL CHIP CARBON 0.15 0.
PAGE 95
HCD-C5 UCOM Ref. No. Part No. Description C231 C241 C243 C244 C294 1-162-927-11 1-127-820-11 1-162-970-11 1-162-964-11 1-162-964-11 CERAMIC CHIP CERAMIC CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 100PF 4.7uF 0.01uF 0.001uF 0.001uF 5% Remarks C501 C502 C503 C504 C505 1-126-916-11 1-164-156-11 1-162-970-11 1-126-160-11 1-162-970-11 ELECT CERAMIC CHIP CERAMIC CHIP ELECT CERAMIC CHIP 1000uF 0.1uF 0.01uF 1uF 0.01uF 20.00% 6.
PAGE 96
HCD-C5 Ver 1.1 2001.09 UCOM Ref. No. Part No. Description Part No.
PAGE 97
HCD-C5 Ver 1.1 2001.09 Ref. No. Part No.
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HCD-C5 REVISION HISTORY Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page. Ver. Date Description of Revision 1.1 2001.09 Addition of Australian, Hong Kong and Korean models. 1.0 2001.