- Standard Microsystems Ethernet Single Chip Product Manual

10/100 Non-PCI Ethernet Single Chip MAC + PHY
Datasheet
SMSC LAN91C111 REV C 127 Revision 1.91 (08-18-08)
DATASHEET
Notes:
1. Controlling Unit: millimeter
2. Tolerance on the position of the leads is + 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Figure 15.2 128 Pin QFP Package Outline, 3.9 MM Footprint
Table 15.2 128 Pin QFP Package Parameters
MIN NOMINAL MAX REMARKS
A ~ ~ 3.4 Overall Package Height
A1 0.05 ~ 0.5 Standoff
A2 2.55 ~ 3.05 Body Thickness
D 23.70 23.90 24.10 X Span
D/2 11.85 11.95 12.05
1
/
2
X Span Measured from Centerline
D1 19.90 20.0 20.10 X body Size
E 17.70 17.90 18.10 Y Span
E/2 8.85 8.95 9.05
1
/
2
Y Span Measured from Centerline
E1 13.90 14.00 14.10 Y body Size
H ~ ~ ~ Lead Frame Thickness
L 0.73 0.88 1.03 Lead Foot Length
L1 ~ 1.95 ~ Lead Length
e 0.5 Basic Lead Pitch
q0
o
~7
o
Lead Foot Angle
W 0.10 ~ 0.30 Lead Width
R1 0.13 ~ ~ Lead Shoulder Radius
R2 0.13 ~ 0.30 Lead Foot Radius
ccc ~ ~ 0.0762 Coplanarity (Assemblers)
ccc ~ ~ 0.08 Coplanarity (Test House)