Installation Guide

Table Of Contents
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Installation
Perform Bond testing to determine compatibility of adhesive to the substrate. Shaw 9050 primer(or equivalent / comparable
product)can be utilized to promote adhesion.
Three internal relative humidity tests should be conducted for areas up to 1000 sq. ft. One additional test, for each additional
1000 sq. ft.
Radiant Heating: Radiant-heated subfloor systems can be concrete, wood or a combination of both.
The heating systems components must have a minimum of 1/2" separation from the flooring product. The system must be on and
operational for at least 2 weeks prior to
installation to reduce residual moisture. Three days prior to installation lower the temperature to
65°F, after installation gradually increase the temperature in increments of 5°F to avoid overheating. Maximum operating temperature
should never exceed 85°F. Use of an in-floor temperature sensor is recommended to avoid overheating. Contact the manufacturer of
your radiant heating system for further r
ecommendations.
Electric Radiant Floors
: consist of electric cables (or) mats of electrically conductive materials mounted on the subfloor below
the floor covering. Mesh systems are typically embedded in thin-set. When embedding the system components, use
cementitious patching and leveling compounds that meet or exceed Shaw’s maximum moisture level and pH requirements.
Use of gypsum-based patching and/or leveling c
ompounds which contain Portland or high alumina cement and meet or exceed
the compressive strength of 3,000 psi are acceptable.
Hydronic Radiant Floors
: pump heated water from a boiler through tubing laid in a pattern under the flooring. Typically installed
in channels under a wooden subfloor (or) imbedded in concrete slabs. Requires the installer follow a specific nailing pattern to
avoid penetration of the heat system.
C. EXISTING FLOOR COVERINGS
Flooring can be installed over most existing hard–surface floor coverings, provided that the existing floor surface is fully adhered, clean,
flat, dry, structurally sound and free of deflection.
Existing sheet vinyl floors should not be heavily cushioned and not exceed more than one layer in thickness. Soft underlayment
and soft substrates will compromise the product's locking ability as well as diminish its indentation resistance.
Installation is NOT allowed over any type of carpet.
Do NOT install over wood floors adhered to concrete.
Never use solvents or citrus adhesive removers to remove old adhesive residue. Solvent residue left in and on the subfloor may
affect the new floor covering.
This product can be installed over existing ceramic/porcelain tile products with up to a 1/4 inch wide grout joint.If the grout joint
width exceeds 1/4 inch, a cementitious patching compound should be used to fill the grout joint to make it smooth with the
surface of the tile.
RAISED ACCESS PANEL SUBFLOORS
Raised access panels must be stable, level, flat, free and clean of existing adhesives
24" x 24" panels are recommended.
Lippage (variation of height) between of panels must notexceed 0.295(0.75 mm)
Gaps between panels must not exceed 0.039” (1 mm)
There should be no deflection of the individual panels – Concave less than 0.0295(0.75 mm)
Flatness 1/8” in 10
Stagger the flooring tiles/planks to overlap the access panels
Telegraphing of access panel seams may be visible and is not considered a product defect nor warranted by the flooring
manufacturer.
If needed, overlay the panels with a 14(6 mm) plywood and properly fasten to the access panels prior to the installation of the
floorcovering. Prior to underlayment installation, repair any loose or unstable panels. Use the appropriate installation methods for the
pr
oduct.
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