PCF8574T Datasheet
Table Of Contents
- 1 FEATURES
- 2 GENERAL DESCRIPTION
- 3 ORDERING INFORMATION
- 4 BLOCK DIAGRAM
- 5 PINNING
- 6 CHARACTERISTICS OF THE I 2 C-BUS
- 7 FUNCTIONAL DESCRIPTION
- 8 LIMITING VALUES
- 9 HANDLING
- 10 DC CHARACTERISTICS
- 11 I 2 C-BUS TIMING CHARACTERISTICS
- 12 PACKAGE OUTLINES
- 13 SOLDERING
- 14 DATA SHEET STATUS
- 15 DEFINITIONS
- 16 DISCLAIMERS
- 17 PURCHASE OF PHILIPS I 2 C COMPONENTS
2002 Nov 22 21
Philips Semiconductors Product specification
Remote 8-bit I/O expander for I
2
C-bus
PCF8574
13.4 Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note
” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
MOUNTING PACKAGE
(1)
SOLDERING METHOD
WAVE REFLOW
(2)
DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable
(3)
− suitable
Surface mount BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable −
HBCC, HBGA, HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
not suitable
(4)
suitable −
PLCC
(5)
, SO, SOJ suitable suitable −
LQFP, QFP, TQFP not recommended
(5)(6)
suitable −
SSOP, TSSOP, VSO not recommended
(7)
suitable −