PCF8574T Datasheet
Table Of Contents
- 1 FEATURES
- 2 GENERAL DESCRIPTION
- 3 ORDERING INFORMATION
- 4 BLOCK DIAGRAM
- 5 PINNING
- 6 CHARACTERISTICS OF THE I 2 C-BUS
- 7 FUNCTIONAL DESCRIPTION
- 8 LIMITING VALUES
- 9 HANDLING
- 10 DC CHARACTERISTICS
- 11 I 2 C-BUS TIMING CHARACTERISTICS
- 12 PACKAGE OUTLINES
- 13 SOLDERING
- 14 DATA SHEET STATUS
- 15 DEFINITIONS
- 16 DISCLAIMERS
- 17 PURCHASE OF PHILIPS I 2 C COMPONENTS
2002 Nov 22 2
Philips Semiconductors Product speciļ¬cation
Remote 8-bit I/O expander for I
2
C-bus
PCF8574
CONTENTS
1 FEATURES
2 GENERAL DESCRIPTION
3 ORDERING INFORMATION
4 BLOCK DIAGRAM
5 PINNING
5.1 DIP16 and SO16 packages
5.2 SSOP20 package
6 CHARACTERISTICS OF THE I
2
C-BUS
6.1 Bit transfer
6.2 Start and stop conditions
6.3 System configuration
6.4 Acknowledge
7 FUNCTIONAL DESCRIPTION
7.1 Addressing
7.2 Interrupt output
7.3 Quasi-bidirectional I/Os
8 LIMITING VALUES
9 HANDLING
10 DC CHARACTERISTICS
11 I
2
C-BUS TIMING CHARACTERISTICS
12 PACKAGE OUTLINES
13 SOLDERING
13.1 Introduction
13.2 Through-hole mount packages
13.2.1 Soldering by dipping or by solder wave
13.2.2 Manual soldering
13.3 Surface mount packages
13.3.1 Reflow soldering
13.3.2 Wave soldering
13.3.3 Manual soldering
13.4 Suitability of IC packages for wave, reflow and
dipping soldering methods
14 DATA SHEET STATUS
15 DEFINITIONS
16 DISCLAIMERS
17 PURCHASE OF PHILIPS I
2
C COMPONENTS