PCF8574T Datasheet
Table Of Contents
- 1 FEATURES
- 2 GENERAL DESCRIPTION
- 3 ORDERING INFORMATION
- 4 BLOCK DIAGRAM
- 5 PINNING
- 6 CHARACTERISTICS OF THE I 2 C-BUS
- 7 FUNCTIONAL DESCRIPTION
- 8 LIMITING VALUES
- 9 HANDLING
- 10 DC CHARACTERISTICS
- 11 I 2 C-BUS TIMING CHARACTERISTICS
- 12 PACKAGE OUTLINES
- 13 SOLDERING
- 14 DATA SHEET STATUS
- 15 DEFINITIONS
- 16 DISCLAIMERS
- 17 PURCHASE OF PHILIPS I 2 C COMPONENTS
2002 Nov 22 17
Philips Semiconductors Product speciļ¬cation
Remote 8-bit I/O expander for I
2
C-bus
PCF8574
12 PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
SOT38-4
92-11-17
95-01-14
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
b
2
e
D
A
2
Z
16
1
9
8
E
pin 1 index
b
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
A
max.
12
b
1
(1) (1)
(1)
b
2
cD E e M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.30
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
0.2542.54 7.62
8.25
7.80
10.0
8.3
0.764.2 0.51 3.2
inches
0.068
0.051
0.021
0.015
0.014
0.009
1.25
0.85
0.049
0.033
0.77
0.73
0.26
0.24
0.14
0.12
0.010.10 0.30
0.32
0.31
0.39
0.33
0.0300.17 0.020 0.13
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4










