ina219 datasheet

INA219
SBOS448G –AUGUST 2008–REVISED DECEMBER 2015 www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
S
Supply voltage 6 V
Differential (V
IN+
– V
IN–
)
(2)
–26 26 V
Analog Inputs
IN+, IN–
Common-mode(V
IN+
+ V
IN–
) / 2 -0.3 26 V
SDA GND – 0.3 6 V
SCL GND – 0.3 V
S
+ 0.3 V
Input current into any pin 5 mA
Open-drain digital output current 10 mA
Operating temperature –40 125 °C
T
J
Junction temperature 150 °C
T
stg
Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) V
IN+
and V
IN–
may have a differential voltage of –26 to 26 V; however, the voltage at these pins must not exceed the range –0.3 to 26 V.
7.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
±4000
Electrostatic
V
(ESD)
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins
(2)
±750 V
discharge
Machine Model (MM) ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
CM
12 V
V
S
3.3 V
T
A
–25 85 ºC
7.4 Thermal Information
INA219
THERMAL METRIC
(1)
D (SOIC) DCN (SOT) UNIT
8 PINS 8 PINS
R
θJA
Junction-to-ambient thermal resistance 111.3 135.4 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 55.9 68.1 °C/W
R
θJB
Junction-to-board thermal resistance 52 48.9 °C/W
ψ
JT
Junction-to-top characterization parameter 10.7 9.9 °C/W
ψ
JB
Junction-to-board characterization parameter 51.5 48.4 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated
Product Folder Links: INA219