bmp280 datasheet
Table Of Contents
- 1. Specification
- 2. Absolute maximum ratings
- 3. Functional description
- 4. Global memory map and register description
- 5. Digital interfaces
- 6. Pin-out and connection diagram
- 7. Package, reel and environment
- 8. Appendix 1: Computation formulae for 32 bit systems
- 9. Legal disclaimer
- 10. Document history and modification
Bosch
Sensortec | BMP280 Data sheet
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Modifications reserved | Data subject to change without notice
Document number: BST-BMP280-DS001-23 Revision_1.23_11202
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7.4 Soldering guidelines
The moisture sensitivity level of the BMP280 sensors corresponds to JEDEC Level 1, see also:
• IPC/JEDEC J-STD-020C “Joint Industry Standard: Moisture/Reflow Sensitivity Classification for non-
hermetic Solid State Surface Mount Devices”
• IPC/JEDEC J-STD-033A “Joint Industry Standard: Handling, Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices”.
The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC standard,
i.e. reflow soldering with a peak temperature up to 260°C. The minimum height of the solder after
reflow shall be at least 50µm. This is required for good mechanical decoupling between the sensor
device and the printed circuit board (PCB).
Figure 20: Soldering profile