bmp280 datasheet
Table Of Contents
- 1. Specification
- 2. Absolute maximum ratings
- 3. Functional description
- 4. Global memory map and register description
- 5. Digital interfaces
- 6. Pin-out and connection diagram
- 7. Package, reel and environment
- 8. Appendix 1: Computation formulae for 32 bit systems
- 9. Legal disclaimer
- 10. Document history and modification
Bosch
Sensortec | BMP280 Data sheet
39 |
48
Modifications reserved | Data subject to change without notice
Document number: BST-BMP280-DS001-23 Revision_1.23_11202
0
7.2 Landing pattern recommendation
For the design of the landing pattern, the following dimensioning is recommended:
Figure 19: Recommended landing pattern (top view); dimensions are in mm
Note: red areas demark exposed PCB metal pads.
• In case of a solder mask defined (SMD) PCB process, the land dimensions should be defined
by solder mask openings. The underlying metal pads are larger than these openings.
• In case of a non solder mask defined (NSMD) PCB process, the land dimensions should be
defined in the metal layer. The mask openings are larger than the these metal pads.
0.35
2.50
0.65
0.5
0.55
2.0
8
7
6
5
1
2
3
4
0.325