pca9306 datasheet
Table Of Contents
- 1 Features
- 2 Applications
- 3 Description
- Table of Contents
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics
- 6.6 Switching Characteristics AC Performance (Translating Down) (EN = 3.3 V)
- 6.7 Switching Characteristics AC Performance (Translating Down) (EN = 2.5 V)
- 6.8 Switching Characteristics AC Performance (Translating Up) (EN = 3.3 V)
- 6.9 Switching Characteristics AC Performance (Translating Up) (EN = 2.5 V)
- 6.10 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 8.1 Overview
- 8.1.1 Definition of threshold voltage
- 8.1.2 Correct Device Set Up
- 8.1.3 Disconnecting a Slave from the Main I2C Bus Using the EN Pin
- 8.1.4 Supporting Remote Board Insertion to Backplane with PCA9306
- 8.1.5 Switch Configuration
- 8.1.6 Master on Side 1 or Side 2 of Device
- 8.1.7 LDO and PCA9306 Concerns
- 8.1.8 Current Limiting Resistance on VREF2
- 8.2 Functional Block Diagram
- 8.3 Feature Description
- 8.4 Device Functional Modes
- 8.1 Overview
- 9 Application and Implementation
- 10 Power Supply Recommendations
- 11 Layout
- 12 Device and Documentation Support
- 13 Mechanical, Packaging, and Orderable Information
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EXAMPLE STENCIL DESIGN
(3.8)
6X (0.65)
8X (0.4)
8X (1.1)
4220784/B 07/2020
SSOP - 1.3 mm max heightDCT0008A
SMALL OUTLINE PACKAGE
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
4
5
8
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X