pca9306 datasheet
Table Of Contents
- 1 Features
- 2 Applications
- 3 Description
- Table of Contents
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics
- 6.6 Switching Characteristics AC Performance (Translating Down) (EN = 3.3 V)
- 6.7 Switching Characteristics AC Performance (Translating Down) (EN = 2.5 V)
- 6.8 Switching Characteristics AC Performance (Translating Up) (EN = 3.3 V)
- 6.9 Switching Characteristics AC Performance (Translating Up) (EN = 2.5 V)
- 6.10 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 8.1 Overview
- 8.1.1 Definition of threshold voltage
- 8.1.2 Correct Device Set Up
- 8.1.3 Disconnecting a Slave from the Main I2C Bus Using the EN Pin
- 8.1.4 Supporting Remote Board Insertion to Backplane with PCA9306
- 8.1.5 Switch Configuration
- 8.1.6 Master on Side 1 or Side 2 of Device
- 8.1.7 LDO and PCA9306 Concerns
- 8.1.8 Current Limiting Resistance on VREF2
- 8.2 Functional Block Diagram
- 8.3 Feature Description
- 8.4 Device Functional Modes
- 8.1 Overview
- 9 Application and Implementation
- 10 Power Supply Recommendations
- 11 Layout
- 12 Device and Documentation Support
- 13 Mechanical, Packaging, and Orderable Information
www.ti.com
EXAMPLE BOARD LAYOUT
(3.8)
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
8X (1.1)
8X (0.4)
6X (0.65)
(R0.05)
TYP
4220784/B 07/2020
SSOP - 1.3 mm max heightDCT0008A
SMALL OUTLINE PACKAGE
SYMM
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
1
4
5
8
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL