pca9539 datasheet
Table Of Contents
- 1 Features
- 2 Description
- Table of Contents
- 3 Revision History
- 4 Description (Continued)
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application And Implementation
- 10 Power Supply Recommendations
- 11 Device and Documentation Support
- 12 Mechanical, Packaging, and Orderable Information
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
EXAMPLE BOARD LAYOUT
4224376 / A 07/2018
www.ti.com
VQFN - 1 mm max height
RGE0024C
PLASTIC QUAD FLATPACK- NO LEAD
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE: 20X
2X
(0.8)
2X(0.8)
(3.8)
( 2.1)
1
6
7
12
13
18
19
24
25
24X (0.6)
24X (0.24)
20X (0.5)
(R0.05)
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
(Ø0.2) VIA
TYP
(3.8)