pca9539 datasheet
Table Of Contents
- 1 Features
- 2 Description
- Table of Contents
- 3 Revision History
- 4 Description (Continued)
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application And Implementation
- 10 Power Supply Recommendations
- 11 Device and Documentation Support
- 12 Mechanical, Packaging, and Orderable Information
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
PACKAGE OUTLINE
www.ti.com
4224376 / A 07/2018
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK- NO LEAD
RGE0024C
A
0.08
C
0.1 C A B
0.05 C
B
SYMM
SYMM
4.1
3.9
4.1
3.9
PIN 1 INDEX AREA
1 MAX
0.05
0.00
SEATING PLANE
C
2X 2.5
2.1±0.1
2X
2.5
20X 0.5
1
6
7
12
13
18
19
24
24X
0.30
0.18
24X
0.50
0.30
(0.2) TYP
PIN 1 ID
(OPTIONAL)
25