User's Manual

Skylab M&C Technology Co., Ltd
SKB501 Typical Lead-free Soldering Profile
Note：The final re-flow soldering temperature map chosen at the factory depends on
additional external factors, for example, choice of soldering paste,size, thickness and
properties of the module`s baseboard etc. Exceeding the maximum soldering temperature
in the recommended soldering profile may permanently damage the module.
Packaging Specification
SKB501 modules are put into tray and 528 units per tray. Each tray is ‘dry’ and vacuum packaging.
SKB501 Packaging
Bluetooth Module
SKB501- User Manual