Data Sheet
Table Of Contents
- 1.简介Brief Introduction
- 2.特点Features
- 3.应用场景Applications
- 4.应用框图Application Block Diagram
- 5.管脚定义Pinout Description
- 6.接口简介Interfaces Introduction
- 7.模组参数Module Specifications
- 8.参考设计原理图Reference Schematic
- 9.PCB设计参考PCB Design Guide
- 10.包装信息Packaging Specification
- 12. 订购信息Ordering Information
- 13. 联系信息Contact Information
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19 / 21 SKB378-DA-001,A/1
深圳市天工测控技术有限公司
Skylab M&C Technology Co., Ltd
SKB378 规格书 datasheet
10.
生产过程推荐
Manufacturing Process Recommendations
Figure 10: SKB378 Typical Lead-free Soldering Profile
注意：
1.最终的炉温曲线取决于工厂的其他因素，如锡膏的种类、尺寸、厚度、模组基板的性质等。
2.超出推荐炉温曲线的最高温度可能会损坏模组！
Note：
1. The final re-flow soldering temperature map chosen at the factory depends on additional external
factors, for example, choice of soldering paste,size, thickness and properties of the module`s baseboard
etc.
2. Exceeding the maximum soldering temperature in the recommended soldering profile may
permanently damage the module!