Specifications

Table of Contents
Introducing US, a Division of MeiVac, Inc............................................................................................ 4
MeiVac, Inc. QUALITY ASSURANCE .................................................................................................... 4
Introducing MAK Sputter Sources........................................................................................................ 4
Magnetron Sputtering?.......................................................................................................................... 5
RF Sputtering.......................................................................................................................................... 7
Operation of the MAK ............................................................................................................................ 8
VACUUM SYSTEMS……………………………………………………………………………………………………………9
Installation of Sources......................................................................................................................... 10
Power Hook-up..................................................................................................................................... 12
DC CONNECTION………………………………………………………………………………………………………….. 12
RF CONNECTION……………………………………………………………………………………………………………12
Target Parameters................................................................................................................................ 14
PURITY………………………………………………………………………………………………………………………14
SURFACE…………………………………………………………………………………………………………………….14
TARGET DIMENSIONS……………………………………………………………………………………………………….14
TARGET SUPPLIERS…………………………………………………………………………………………………………14
MACHINABLE MATERIALS……………………………………………………………………………………………………15
NON-MACHINABLE MATERIALS……………………………………………………………………………………………...16
Target Mounting……………………………………………………………………………………………….. 16
Rate vs. Power…………………………………………………………………………………………………..18
Relative Sputtering Rates of 50 Materials………………………………………………………………….18
Relative Rates of Sputtering Sources vs. Distance……………………………………………………… 19
Returns & Warranty.............................................................................................................................. 20
APPENDIX A: MAK TECHNICAL SPECIFICATIONS .......................................................................... 21
APPENDIX B: TARGET SUPPLIERS ................................................................................................... 23
TARGET DIMENSIONS 1.3" 2.0" 3.0" 4.0" 6.0"
SPARE PARTS 1.3" 2.0" 3.0" 4.0" 6.0"
TUTORIALS {Benefits} {Simplicity} {TargetMounting}
Issued September 11, 2008
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