Specifications

Precautions to assure the proper operation of your MAK Source

CAUTION

• Water MUST be flowing thru the MAK while sputtering. Please see O&M manual for flow

requirements.

If MAK has been operated without water --- DO NOT turn the water on --- allow

the MAK to cool down before turnin

water on.

• Target paste [supplied with MAK] MUST be used. This provides a thermal layer between

the target and cathode [Copper block]. It is required to protect against uneven or irregular

surfaces of the target and / or cathode.

CAUTION

Failure to use target paste can damage the MAK. A VERY SMALL AMOUNT

MUST BE APPLIED -- A GLOVED FINGER USED TO SPREAD EVENLY OVER

THE CATHODE BLOCK. The block should be clearly visible --- thru a thin gray

film.

NOTE: A substitute paste such as thin [0.005”] Indium foil can also be used.

•

Ceramic or Oxide targets --- MUST --- be bonded to a copper backing plate that con-

tains a keeper.

• A keeper MUST be used for all targets --- including magnetic. The keeper is used for

centering the target and maintaining a continuous magnetic path.

•

MAK Sputter Sources should be CLEANED on a routine basis. This is easily accom-

plished during target change.

1. With target removed, clean entire cathode assembly --- removing any foreign material

present. Cleaning of both inside and outside of the block is suggested.

2. Clean the anode shield.

Issued September 11, 2008