TM OWNER’S OPERATION AND MAINTENANCE MANUAL OF THE MAK SPUTTERING SOURCES 5830 Hellyer Avenue San Jose, CA 95138 PH: (408) 362.1000 FX: (408) 362.1010 E-MAIL: support@meivac.com YOUR S/N _____________________________ WARNING AS WITH ALL ELECTRICAL DEVICES, THERE IS A SHOCK HAZARD ASSOCIATED WITH THIS DEVICE. ALL INSTRUCTIONS SHOULD BE FOLLOWED PERTAINING TO THE USE OF SUITABLE INTERLOCKS ON ALL POWER SUPPLIES TO BE USED TO POWER THIS PRODUCT.
Precautions to assure the proper operation of your MAK Source • Water MUST be flowing thru the MAK while sputtering. Please see O&M manual for flow requirements. CAUTION If MAK has been operated without water --- DO NOT turn the water on --- allow the MAK to cool down before turning water on. • Target paste [supplied with MAK] MUST be used. This provides a thermal layer between the target and cathode [Copper block].
Table of Contents Introducing US, a Division of MeiVac, Inc............................................................................................ 4 MeiVac, Inc. QUALITY ASSURANCE .................................................................................................... 4 Introducing MAK Sputter Sources........................................................................................................ 4 Magnetron Sputtering?.................................................................
INTRODUCING US, a Division of MeiVac, Inc. US has been an innovative manufacturer of sputtering since 1977. Exclusive licenses were obtained from Stanford University and Lawrence Livermore Laboratory to build and distribute their patented magnetron sputtering sources on a worldwide basis. MeiVac, Inc. QUALITY ASSURANCE All MeiVac products are manufactured under the most stringent conditions.
MAGNETRON SPUTTERING Observations of the phenomenon we now call sputtering, go back over one hundred years to early experiments which introduced electricity into a reduced pressure atmosphere. L. Holland describes these beginnings in his book Vacuum Deposition of Thin Films. “When an electrical discharge is passed between electrodes at a low gas pressure, the cathode electrode is slowly disintegrated under the bombardment of the ionized gas molecules. This phenomenon is termed cathodic sputtering.
In order to increase sputtering rate, magnetic coils were sometimes placed around the chamber to pinch the plasma during the deposition. The pressure was reduced to 20 microns (2 X 10-2 torr) and the rates increased. The electrodes were close together and the R.F. voltage was high. These conditions caused damage to semiconductor devices due to the high electron and secondary ion bombardment, which took place.
RF SPUTTERING If the target is an insulator, the neutralization process results in a positive charge on the target surface. This charge may grow to the point that the bombarding ions (±) are repelled and the sputtering process will stop. In order to make the process continue the polarity of the target must be reversed to attract enough electrons from the discharge to eliminate the surface charge.
OPERATION OF THE MAK VACUUM SYSTEMS To successfully operate the MAK Series, a leak-tight vacuum system must be available. This system should be pumped with a high vacuum pump of the turbo, or a cryo type. It may be necessary to have a throttle valve, or orifice in the system to control pump throughput while the sputtering gas is introduced. If a cryopump is used, the throttle valve may not be required, however, it is desirable if sputtering gas pressures of more than five microns are to be used.
To obtain ideal uniformity, the distance from source to substrate should be adjustable. Note: The rate will decrease by the square of the distance from source to substrate, however uniformity will be enhanced as this distance is increased. The chamber may be made of glass or metal. If the chamber is metal, a viewing port should be provided for observation during sputtering.
INSTALLATION OF SOURCES STANDARD MOUNTING To mount the source a QUICK COUPLE feedthrough adapter is required. A 0.75” adapter is used for the 1.3”, 2”, and 3”, and 4” sources. The 6” MAK requires a 1.25” quick coupler adapter. Water Lines Power Connector (HN) End Adapter Atmosphere Vacuum Vessel HN Power Pin Tube Clamp Quick Coupler MAK Installed in Vacuum Chamber A. PREPARING THE SOURCE FOR MOUNTING VIA A QUICK COUPLER 1.
7. Slide the End Adapter on the tube, making sure that the slip pin in the connector body is in- serted in the socket of the power feed rod. Push on as far as it will go and tighten the screws. 8. The system may now be pumped down. 9. Hook up the water lines. Connect the house supply and drain lines to the source tubes. See technical specifications for minimum flow requirements. 10. Connect the power cable. B. DIRECT FLANGE MOUNTING VIA CF, ISO, ANSI, JIS and other flanges 1.
POWER HOOK-UP All MAK sputter sources may be operated in either the DC or RF mode. All models are supplied with an HN (Amphenol UG-496/U) for convenient electrical connection to your choice of power source. The following US Sputtering Power Supplies come complete with output cables having the HN mating connector.
RF Generator Auto Tuning Network D Connector to D Connector Power Connection 50 Pin Connectors with metal covers 12’ RG-8U Cable with N Type Connections Input Power Connection 3’ or 5’ RG 393/U Cable with HN Connector OUTPUT TO SPUTTERING CAUTIONS IN RF HOOK-UP Cable length between should be a derivative of the 13.56 MHz. Wave length. Approximately 48, 24, or 12 feet and be 50 ohm RF shielded cable.
TARGET PARAMETERS Purity Target material for the MAK sputtering source is not confined to a minimum or maximum purity level. This parameter is dependent upon film requirements. Surface The mounting (bottom side) surface of the target should be smooth and flat to allow good contact to source. The top and bottom of the target should be parallel for best deposition uniformity. Target Dimensions See the Target Specifications at www.us-incorp.com. [1.3” MAK] [2.0” MAK] [3.0” MAK] [4.0” MAK] [6.
Machinable Materials The target keeper can be attached to machinable materials by drilling and tapping the target to 90% of it’s thickness and attaching the keeper using a vented flat head screw. TARGET MOUNTING OF THE MAK MACHINABLE MATERIALS By attaching a magnetic keeper to the target, the MAK source uses the magnetics of the gun to hold the target in place. If you have old targets, NO PROBLEM! Drill and tap your existing targets as shown and attach the metallic keeper. Then, snap the target into place.
Non-Machinable Materials Ceramic and oxide materials, a copper backing plate containing a magnetic keeper should be used. The target must be bonded to this backing plate and this bond must be able to withstand a temperature of 220oC. TARGET MOUNTING OF THE MAK NON-MACHINABLE MATERIALS Backing Plates Ceramics, oxides, and any other non- machinable targets are commonly bonded to a copper backing plate for all sputtering sources.
Copper Backing Plate Specifications (See Appendix A) MAK 1.
RATE VS. POWER When gathering rate data, it is also desirable to take rates at different power levels. These values can be plotted to produce a graph similar to the one shown. Please Note: For approximating DC rates, multiply by 1.75. CO PPER 2" Dia., 3" Dist. 40.00 35.00 Å 30.00 / 25.00 s 20.00 e 15.00 c 10.00 5.00 RELATIVE SPUTTERING RATES OF 0.
RELATIVE RATES OF SPUTTERING SOURCES VS DISTANCE Rate data, for sputtering with small sources, is usually taken by making step samples and then measuring them with either profilometer or interferometer. A quartz crystal microbalance type rate monitor may also be used. If a rate monitor is used, the geometry and the density of the deposit must be taken into account.
Claims & Returns Shipping and Handling Claims Purchaser should inspect the product carefully as soon as it is received and test it in accordance with any instructions that may be provided. If damage is noted, or the product fails to operate properly as the result of shipping or handling damage, a claim should be filed with the common carrier and a copy forwarded to MeiVac or its distributor.
Appendix A MAK TECHNICAL SPECIFICATIONS MAK SIZE: MAK 1.3" MAK 2" MAK 3" MAK 4" MAK 6" (33mm) (50.8mm) (76.2mm) (101.6mm) (152.4mm) TARGET mm inch 1.00-5.70 0.040-0.225 1.00-9.50 0.040-0.375 1.00-15.90 0.040-0.625 1.00-19.05 0.040-0.750 2.00-25.40 0.080-1.000 mm inch 1.00-2.54 0.040-0.100 1.00-4.70 0.040-0.187 1.00-6.35 0.404-0.250 1.00-9.50 0.404-0.375 2.00-11.00 0.080-0.437 ccm cu inch 4.90 0.30 19.25 1.17 72.47 4.42 154.00 9.40 463.00 28.25 cm. sq. sq in 8.56 1.33 20.27 3.
Appendix A MAK TECHNICAL SPECIFICATIONS COOLING Water Flow at 30psi min. at lowest power level Nominal Water Flow at 60psi for max. power Water Pressure Range MAK 1.3" MAK 2" MAK 3" MAK 4" MAK 6" (33mm) (50.8mm) (76.2mm) (101.6mm) (152.4mm) l/min gal/min 3.48 0.90 3.48 0.90 3.48 0.90 3.48 0.90 7.00 1.840 l/min gal/min 6.20 1.60 6.20 1.60 6.20 1.60 6.20 1.60 12.40 3.20 2.1-5.6 30-80 2.1-5.6 30-80 2.1-5.6 30-80 2.1-5.6 30-80 2.1-5.
APPENDIX B TARGET SUPPLIERS ACI Alloys, Inc. 1985 Las Plumas Avenue San Jose, CA 95133 Larry Albert PH: (408) 259-7337 FX: (408) 729-0277 www.acialloys.com SCI Engineered Materials 2839 Charter St. Columbus, OH 43228 PH: (800) 346-6567 FX: (800) 292-8654 www.sciengineeredmaterials.com Cerac, Inc. Box 1178 Milwaukee, WI 53201 Rick Vehlow PH: (414) 289-9800 FX: (414) 289-9805 www.cerac.com Sputtering Target Manufacturing Co. 1005 Corbin Court Westerville, OH 43081 J.R.
1.3” MAK US Part Number Description L130-04 Ceramic Ground Shield L130-06 Ring Magnet L130-09 Stainless Steel Ground Shield L130A14 Block Assembly J1200-06 Center Magnet J1200-33 O-Ring J1200-34M Metal Seals J1234-30 Water Lines (2) LL-130-01 Keeper w/ hole & screw (pkg. 10) MAK-130-BP Copper Backing Plate w/ Keeper TP-832 Thermal Contact Paste - 0.5 oz.
2.0” MAK US Part Number Description L200-07 Ring Magnet L200-10 Aluminum Ground Shield L200A14 Block Assembly J1200-06 Center Magnet J1200-33 O-Ring J1200-34M Metal Seals J1234-30 Water Lines (2) LL-200-01 Keeper w/ hole & screw 10) MAK-200-BP Copper Backing Plate w/ Keeper TP-832 Thermal Contact Paste - 0.5 oz. w/ ferrules (pkg.
3.0” MAK US Part Number Description L300-10 Aluminum Ground Shield (OLD STYLE MAK SOURCE ONLY) L300-10NT Aluminum Ground Shield L300-13 Center Magnet L300-24 Ring Magnet L300A14 Block Assembly J3400-33 O-Ring J3400-34M Metal Seals J1234-30 Water Lines (2) w/ ferrules LL-300-01 Keeper w/ hole & screw (pkg. 10) MAK-300-BP Copper Backing Plate w/ Keeper TP-832 Thermal Contact Paste - 0.5 oz.
4.0” MAK US Part Number Description L400-10 Aluminum Ground Shield L400A20 Center Magnet Assembly L400A14 Block Assembly J4600-13 Center Magnet J4600-32 Ring Magnet Segment each) J3400-33 O-Ring J3400-34M Metal Seals J1234-30 Water Lines (2) LL-400-01 Keeper w/ hole & screw (pkg. 2) MAK-400-BP Copper Backing Plate w/ Keeper TP-832 Thermal Contact Paste - 0.5 oz. (10 @ 31.
6.0” MAK US Part Number Description L600-10 Aluminum Ground Shield L600-40 O-ring Magnet Plug L600-41 O-Ring L600A14 Block Assembly L600A20 Center Magnet Assembly J4600-13 Center Magnet J4600-32 Ring Magnet Segments each) L600-42 Water Lines (2) w/ ferrules LL-600-01 Keeper w/ hole & screw (pkg. 2) MAK-600-BP Copper Backing Plate w/ Keeper TP-832 Thermal Contact Paste - 0.5 oz. (16 @ 31.
BENEFITS OF THE MAK SIMPLICITY IN SPUTTERING Water Isolated from: • MAGNETS - NO magnet erosion • POWER - (ALL electrical components) – no power changes due to water resistance – simplifies RF Tuning NO special treatment of water needed • Cooling Channel 1 OF 3 Cathode (Copper) Only small volume above AlN has electrical potential applied, THUS…..
BENEFITS OF THE MAK SIMPLICITY IN SPUTTERING 2 OF 3 Magnetics Cathode • • Ring Magnet Balanced / Unbalanced Magnet array is INTERCHANGEABLE from balanced or unbalanced. Disassembly of source NOT REQUIRED! No Magnetic Housing Provides higher magnetic density at target surface THUS…..
BENEFITS OF THE MAK SIMPLICITY IN SPUTTERING Physical Parameters PICTURE SHOWN IS NOT TO SCALE VACUUM SEAL • • • • 3 OF 3 One Vacuum Seal Elastomer (HV) or Metal (UHV) field interchangeable No water to Vacuum Seal • Small Profile Mounts on CF, ISO or installs thru a Quick Disconnect As example, standard 3” MAK fits thru opening of 6” CF (DN100) • Anode Height adjustable to target thickness Selectively positioning anode to same plane of target--- minimizing material build-up No Mechanical Target C
Simplicity in Sputtering INTRODUCING The MAK Planar Magnetron Sputtering Source 1
Simplicity in Sputtering Target Installation on the MAK Cathode Magnets Target Keeper 2
Simplicity in Sputtering • Targets mounted by attraction of the center magnet • No mechanical clamping of the target THUS….. • Ease of target change • Adjustable anode THUS…..
Simplicity in Sputtering MAK without target installed Target Keeper Cathode Adjustable Anode 4
Simplicity in Sputtering Target mounted with magnetic keeper MAK with target installed Anode retracted 5
Simplicity in Sputtering The MAK with target and anode Slotted anode allows for variable target thickness Anode adjusted to accommodate thicker target Target 6
Simplicity in Sputtering MAK target installed w/o anode 0.
TARGET MOUNTING OF THE MAK NON-MACHINABLE MATERIALS 1 OF 2 Backing Plates Ceramics, oxides, and any other nonmachinable targets are commonly bonded to a copper backing plate for all sputtering sources. Cu plate with drill and tapped hole Copper Backing Plate MAK Backing Plates The MAK sputter source uses the same backing plate, but with a magnetic keeper attached. The keeper holds the target in place without a mechanical clamp.
TARGET MOUNTING OF THE MAK NON-MACHINABLE MATERIALS 2 OF 2 bond Bonded Target - Example This is an example of a SiO2 target bonded to a copper backing plate with a magnetic keeper attached.
TARGET MOUNTING OF THE MAK MACHINABLE MATERIALS 1 OF 1 By attaching a magnetic keeper to the target, the MAK source uses the magnetics of the gun to hold the target in place. If you have old targets, NO PROBLEM! Drill and tap your existing targets as shown and attach the metallic keeper. Then, snap the target into place.
