Hardware Design V1.01(091226)
Table Of Contents
- Contents
- Version history
- 1 Introduction
- 2 SIM900 Overview
- 3 Application Interface
- 3.1 SIM900 Pin Description
- 3.2 Operating Modes
- 3.3 Power Supply
- 3.4 Power Up and Power Down Scenarios
- 3.5 Power Saving
- 3.6 Summary of State Transitions (except SLEEP mode)
- 3.7 RTC Backup
- 3.8 Serial Interfaces
- 3.9 Audio Interfaces
- 3.10 SIM Card Interface
- 3.11 LCD Display Interface
- 3.12 Keypad Interface
- 3.13 ADC
- 3.14 Behaviors of the RI
- 3.15 Network Status Indication
- 3.16 General Purpose Input Output (GPIO)
- 3.17 External Reset
- 3.18 PWM
- 3.19 I2C Bus
- 4 Antenna Interface
- 5 Electrical, Reliability and Radio Characteristics
- 6 Mechanics
SIM900 Hardware Design
Table 29: SIM900 current consumption
Voice Call
GSM 850/EGSM 900 @power level #5 <300mA,Typical 250mA
@power level #10,Typical 110mA
@power level #19,Typical 76mA
DCS 1800/PCS 1900 @power level #0 <200mA,Typical 168mA
@power level #10,Typical 89mA
@power level #15,Typical 76mA
GPRS Data
DATA mode, GPRS ( 1 Rx,1 Tx ) CLASS 8
GSM 850/EGSM 900 @power level #5 <300mA,Typical 240mA
@power level #10,Typical 110mA
@power level #19,Typical 83mA
DCS 1800/PCS 1900 @power level #0 <200mA,Typical 170mA
@power level #10,Typical 95mA
@power level #15,Typical 80mA
DATA mode, GPRS ( 3 Rx, 2 Tx ) CLASS 10
GSM 850/EGSM 900 @power level #5 <450mA,Typical 440mA
@power level #10,Typical 185mA
@power level #19,Typical 130mA
DCS 1800/PCS 1900 @power level #0 <350mA,Typical 300mA
@power level #10,Typical 155mA
@power level #15,Typical 122mA
DATA mode, GPRS ( 4 Rx,1 Tx ) CLASS 8
GSM 850/EGSM 900 @power level #5 <300mA,Typical 270mA
@power level #10,Typical 150mA
@power level #19,Typical 120mA
DCS 1800/PCS 1900 @power level #0 <300mA,Typical 205mA
@power level #10,Typical 130mA
@power level #15,Typical 115mA
Class 10 is default set when the module works at data translation mode, the module can also work at class 8 set by
AT command.
5.5 Electro-Static Discharge
The GSM engine is not protected against Electrostatic Discharge (ESD) in general. Therefore, it is subject to ESD
handing precautions that typically apply to ESD sensitive components. Proper ESD handing and packaging
procedures must be applied throughout the processing, handing and operation of any application using a SIM900
module.
The measured values of SIM900 are shown as the following table:
SIM900_HD_V1.01 26.12.2009
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