SIM8300G-M2 Hardware Design V1.01 Draft
Table Of Contents
- Contents
- Table Index
- Figure Index
- 1. Introduction
- 2. Package Information
- 3. Interface Application
- 4. Antenna Interfaces
- 5. Electrical Specifications
- 6. Appearance
- 7. Packaging
- 8. Appendix
SIM8300G-M2 Hardware Design V1.01
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5.8 ESD*
SIM8300G-M2 is sensitive to ESD in the process of storage, transporting, and assembling. When module is
mounted on the customer’s main board, the ESD components should be placed closed to the connectors
which human body may touch, such as (U)SIM card holder, audio jacks, switches, USB interface, etc. The
following table shows the module ESD test performance.
Table 54: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)
Part
Contact discharge
Air discharge
VBAT,GND
TBD
TBD
Antenna
TBD
TBD
FULL_CARD_POWER_OFF#
TBD
TBD
USB
TBD
TBD
RESET#
TBD
TBD
(U)SIM
TBD
TBD
Other PAD
TBD
TBD
Test conditions:
1. The external of the module has surge protection diodes and ESD protection diodes.
2. The data in Table 54 was tested using SIMCom EVB.
NOTE