SIM8300G-M2 Hardware Design V1.01 Draft

SIM8300G-M2 Hardware Design V1.01
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5.7 Thermal Design
Make sure that the SIM8300G-M2 can reach maximum work performance under extended temperature or
extreme conditions for a long time, thermal dissipation design is very important.
It is strongly recommended to add a thermal pad on the customer’s main PCB, add thermally conductive
material on top of the module as well as between the module and the main PCB. The thermal dissipation
area and the dimensions on top and bottom side of the module are shown in the following figure. The
dimensions are measured in mm.
Figure 31: Thermal dissipation area on bottom side of the module
There are some design rules to enhance thermal dissipation performance:

Keep the module away from other heat sources such as battery, power, AP, etc.

Make sure that the module mounting holes connect to the main PCB ground fully.

Add enough through via on the main PCB. Via material is very important solid copper and stacked via
is better.

Make sure maximize airflow around the module.

Recommend use heat dissipation material connect to the customer’s devices on the top side of the
module to enhance the heat dissipation. Large thermal dissipation area is better.

Select a high effective heat dissipation material is better such as heat pipe, graphite sheets. The
recommend thermal conductivity is 8w/m-k.