SIM8300G-M2 Hardware Design V1.01 Draft

SIM8300G-M2 Hardware Design V1.01
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The (U)SIM card layout guidelines:

Make sure that the (U)SIM card holder should be far away from the antenna while in PCB layout.

(U)SIM traces should keep away from RF lines, VBAT and high-speed signal lines.

The traces should be as short as possible.

Keep (U)SIM holder’s GND connect to main ground directly.

Shielding the (U)SIM card signal by ground.

Recommended to place a 33pF
～
1uF capacitor on (U)SIM_PWR line and keep close to the holder.

The rise/fall time of (U)SIM_CLK should not be more than 40ns.

The parasitic capacitance of TVS should not exceed 60pF and the TVS should be placed close to the
(U)SIM socket.
3.9 I2S Interface
SIM8300G-M2 supports one I2S interface for external codec, which follows the requirements in the Phillips
I2S bus specification.
Table 24: I2S format
For the details about I2S AT commands, please refer to document [1] in the appendix.
3.9.1 I2S Timing
The module supports I2S sampling rate of 48 KHz and 32 bit coding signal (16 bit length), the timing
sequence is shown in the following figure.
Characteristics
Specification
Line interface format
Linear(Fixed)
Data length
16bits(Fixed)
I2S clock/sync source
Master mode(Fixed)
I2S clock frequency
1.536MHz (Default)
I2S MCLK frequency
12.288MHz (Default)
Data ordering
MSB
NOTE