SIM8300G-M2 Hardware Design V1.01 Draft

SIM8300G-M2 Hardware Design V1.01
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Table 16: Definition of USB interface
Pin name
Pin no.
Electrical
description
description
Comment
USB_D+
7
AIO
Differential USB bi-directional
data positive
USB3.1 data rate up
to 10Gbps
USB2.0 data rate up
to 480Mbps
USB_D-
9
AIO
Differential USB bi-directional
data negative
USB3.1_Tx-
29
AO
USB3.1 transmit data
negative
USB3.1_Tx+
31
AO
USB3.1 transmit data
positive
USB3.1_Rx-
35
AI
USB3.1 receive data
negative
USB3.1_Rx+
37
AI
USB3.1 receive data
positive
Table 17: USB interface recommended TVS diode list
No.
Manufacturer
Part number
Package
1
WILL
ESD5302N-3/TR
DFN1006-3L
USB HS D+/D- layout guidelines:
Require differential trace impedance is 90±10% Ω.
The intra-lane length mismatch of the differential signal lanes is less than 1mm.
Gap from other signals keeps 3xline width.
External components should be placed near the USB connector.
Trace routes away from other sensitive signals.
The TVS diode should be placed close to the USB pins of M.2 connector.
USB SS TX/RX layout guidelines:
Require differential trace impedance is 90±10% Ω.
The intra-lane length mismatch of the differential signal lanes is less than 700um.
Gap from other signals keeps 4xline width.
Gap between Rx-to-Tx keeps 4xline width.
External components should be placed near the USB connector.
Trace routes away from other sensitive signals.
The TVS diode should be placed close to the USB pins of M.2 connector.