SIM8300G-M2 Hardware Design V1.01 Draft

SIM8300G-M2 Hardware Design V1.01
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Table 5: Pin description
Pin name
Pin
No.
Electrical
Description
Description
Comment
Power supply
VBAT
2,4,70,7
2,74
PI
Power supply
Range
3.1354.4V
Typical3.8V
These pins should be
connected together to
withstand sufficent
current
GND
3,5,11,2
7,33,39,
45,51,5
7,71,73
Ground
System control
FULL_CARD_PO
WER_OFF#
6
DI,PD
High level: the module
power on
Low level: the module
power off
It’s 3.3V tolerant but can
be driven by either 1.8V
or 3.3V GPIO
RESET#
67
P3
DI,PU
System reset control input
Active low
RESET# has been
pulled up to 1.8V
internally
W_DISABLE1#
8
DI
WWAN RF disable
Active low
3.3V tolerant but can be
driven by either 1.8V or
3.3V GPIO
W_DISABLE2#*
26
DI
GNSS disable
Active low
3.3V tolerant but can be
driven by either 1.8V or
3.3V GPIO
WoWWAN#
23
OD
Wake on the host
Active low
Configuration pins
CONFIG_0
21
GND
Connected to ground
internally
The module is
configured as the
WWAN USB3.1
interface type
CONFIG_1
69
GND
Connected to ground
internally
CONFIG_2
75
GND
Connected to ground
internally
CONFIG_3
1
NC
Not connected
USB2.0/USB3.1
USB_D+
7
AIO
Differential USB
bi-directional data positive
Main communication
interface
USB3.1 data rate up to
10Gbps
USB2.0 data rate up to
480Mbps
USB_D-
9
AIO
Differential USB
bi-directional data negative
USB3.1_Tx-
29
AO
USB3.1 transmit data
negative
USB3.1_Tx+
31
AO
USB3.1 transmit data
positive
USB3.1_Rx-
35
AI
USB3.1 receive data
negative
USB3.1_Rx+
37
AI
USB3.1 receive data
positive
PCIe interface
PETn0
41
AO
PCIe transmit data
Support PCIe Gen 3.0,