SIM8300G-M2 Hardware Design 5G Module SIMCom Wireless Solutions Limited. Building B, SIM Technology Building, No.633, Jinzhong Road Changning District, Shanghai P.R.China Tel: 86-21-31575100 support@SIMcom.com www.SIMcom.
SIM8300G-M2 Hardware Design V1.01 Document Title: Version: Date: Status: SIM8300G-M2 Hardware Design V1.01 2020-08-31 Draft Version GENERAL NOTES SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS TO SUPPORT THE APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM. THE INFORMATION PROVIDED IS BASED ON THE REQUIREMENTS SPECIFICALLY FROM THE CUSTOMERS.
SIM8300G-M2 Hardware Design V1.01 Version History Data Version Description of change 2020-08-04 1.00 Draft Version Jia.Wang Changshun.Tan Yao.Chen 2020-08-31 1.01 1.Update RF bands information in table 1 2.Update data transfer rate in table 2 Yibo.Zhong Tao.Tian www.simcom.
SIM8300G-M2 Hardware Design V1.01 Contents Contents................................................................................................................................................................ 4 Table Index............................................................................................................................................................6 Figure Index....................................................................................................................
SIM8300G-M2 Hardware Design V1.01 4.1.2 GNSS Frequency................................................................................................................................49 4.2 Antenna Installation........................................................................................................................................50 4.2.1 Antenna Requirements...................................................................................................................... 50 4.2.
SIM8300G-M2 Hardware Design V1.01 Table Index Table 1: SIM8300G-M2 frequency bands................................................................................................................... 9 Table 2: Key features.................................................................................................................................................... 11 Table 3: IO parameters definition.........................................................................................................
SIM8300G-M2 Hardware Design V1.01 Table 41: GNSS frequency..........................................................................................................................................49 Table 42: 3G/4G/5G/GNSS antennas....................................................................................................................... 50 Table 43: GNSS antenna (for dedicated GNSS antenna only)*...........................................................................
SIM8300G-M2 Hardware Design V1.01 Figure Index Figure 1: Block diagram............................................................................................................................................... 10 Figure 2: Pin assignment............................................................................................................................................. 13 Figure 3: Dimensions of the module (unit: mm)................................................................................
SIM8300G-M2 Hardware Design V1.01 1. Introduction This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and test results of the SIM8300G-M2 module. With the help of this document，customers can quickly understand SIM8300G-M2 module. Associated with other software application notes and user guides, customers can use SIM8300G-M2 to design and develop mobile and laptop applications easily. 1.
SIM8300G-M2 Hardware Design V1.01 The physical dimension of SIM8300G-M2 is 30.0mm*52.0mm*3.65mm, which can meet PCI Express M.2 specifications, and can meet almost all space requirements in customer’s applications. With M.2 Type 3052, SIM8300G-M2 owns rich interfaces, includes USB3.1, PCIe3.0, (U)SIM card, digital audio (I2S or PCM), I2C, GPIOs, four antennas for 3G/4G/5G and GNSS.
SIM8300G-M2 Hardware Design V1.01 1.3 Feature Overview Table 2: Key features Feature Implementation Power supply1 VBAT: 3.135～4.4V Typical: 3.8V Power consumption* TBD @sleep mode(VBAT=3.
SIM8300G-M2 Hardware Design V1.01 USB2.0: high speed interface, support USB operations at low-speed and full-speed, which refer to USB1.0 and USB1.1 Firmware upgrade Physical characteristics Temperature range Firmware upgrade over USB interface Size: 30mm*52mm*3.65mm Weight: TBD Normal operation temperature: -30°C to +70°C 3GPP compliant Extended operation temperature: -40°C to +85°C3 Storage temperature: -40°C to +90°C NOTE 1. The recommended operating voltage of the module is 3.8V.
SIM8300G-M2 Hardware Design V1.01 2. Package Information 2.1 Pin Assignment Overview SIM8300G-M2 has 75 pins, including 8 notch pins. Customer design should match pins functions. The following figure is the pin assignment of the module. Figure 2: Pin assignment www.simcom.
SIM8300G-M2 Hardware Design V1.01 2.2 Pin Description Table 3: IO parameters definition Pin type Description PI Power Input PO Power Output AI Analog Input AIO Analog Input/Output DIO Bidirectional Digital Input /Output DI Digital Input DO Digital Output DOH Digital Output with High level DOL Digital Output with Low level PU Pull Up PD Pull Down OD Open Drain OC Open Collector Table 4: DC parameters definition Voltage domain P3 Parameter Typ Max VDD_P3=1.
SIM8300G-M2 Hardware Design V1.01 Table 5: Pin description Pin name Power supply VBAT Pin No. Electrical Description 2,4,70,7 2,74 PI Description Comment Power supply Range：3.135～4.4V These pins should be connected together to withstand sufficent current Typical：3.
SIM8300G-M2 Hardware Design V1.01 negative PETp0 43 AO PCIe transmit data positive PERn0 47 AI PCIe receive data negative PERp0 49 AI REFCLKN 53 AIO REFCLKP 55 AIO PCIe receive data positive PCIe reference clock negative PCIe reference clock positive data rate up to 8Gbps.
SIM8300G-M2 Hardware Design V1.01 I2S_MCLK 60 P3 DO I2S master clock I2C_SDA 68 P3 DIO I2C data signal I2C_SCL 38 P3 DO I2C clock signal I2C interface 1.8V voltage domain, Internal pulled up to 1.8V.
SIM8300G-M2 Hardware Design V1.01 2.3 Mechanical Dimensions The following figure shows the mechanical dimensions of SIM8300G-M2. Figure 3: Dimensions of the module (unit: mm) www.simcom.
SIM8300G-M2 Hardware Design V1.01 3. Interface Application 3.1 Power Supply The recommended power supply of SIM8300G-M2 is 3.8V and the voltage ranges from 3.135 V to 4.4 V. Please make sure that the input voltage will never drop below 3.135V, otherwise the module will be powered off automatically. The module has 5 power pins and 11 ground pins. To ensure the module works properly, all pins should be connected. Table 6: VBAT pins electrical characteristics* Symbol Description Min. Typ. Max.
SIM8300G-M2 Hardware Design V1.01 NOTE Test conditions: 1. “*” means under development. 2. The total capacitors of VBAT net are not less than 420uF. 3. The data in Table 6 and Figure 4 is TBD. To decrease the voltage dropping, make sure the VBAT voltage no less than 3.135V. The following figure shows the reference circuit of power supply for the VBAT. Figure 5: Power supply reference circuit Table 7: Definition of VBAT and GND pins Pin name VABT GND Pin no.
SIM8300G-M2 Hardware Design V1.01 circuit board wider than 3.0mm to minimize PCB trace impedance. NOTE 1. C5 is 220 µF tantalum capacitor, ESR=0.7Ω. 2. C1 and C2 are multi-layer ceramic chip (MLCC) capacitors from 33pF to 1uF with low ESR in high frequency band, which can be used for EMC performance. 3. D2 is used for ESD protection and D1 is used for surge protection. Table 8: Recommended D1 and D2 list No. Manufacturer Part number VRWM Package Ref.
SIM8300G-M2 Hardware Design V1.01 Figure 6: Switching mode power supply reference circuit NOTE 1. In order to avoid damaging the module, please do not switch off the power supply when module works normally. Only after the module is shut down by FULL_CARD_POWER_OFF# or AT command, then the power supply can be cut off. 2. It is suggested that customer's design should have the ability to switch off the power supply for module in abnormal state, and then switch on the power to restart the module. 3.
SIM8300G-M2 Hardware Design V1.01 3.2 Power On and Off Module Driving the FULL_CARD_POWER_OFF# pin to a high level, SIM8300G-M2 will be powered on. It can be driven by either 1.8V or 3.3V GPIO. The following figure shows the power on/off circuit. Figure 7: Reference power on/off circuit www.simcom.
SIM8300G-M2 Hardware Design V1.01 Table 9: Definition of FULL_CARD_POWER_OFF# pin Pin name Pin no. FULL_CARD_ POWER_OFF# 6 Electrical description description Comment DI,PD High level: the module powers on Low level: the module powers off It’s 3.3V tolerant but can be driven by either 1.8V or 3.3V GPIO 3.2.1 Power On The power on sequence is shown in the following figure. Figure 8: Power on sequence Table 10: Power on timing and electrical characteristics Symbol Parameter Min. Typ. Max.
SIM8300G-M2 Hardware Design V1.01 3.2.2 Power Off The following methods can be used to power off the module. ● Method 1: Power off the module by holding the FULL_CARD_POWER_OFF# pin to low level. ● Method 2: Power off module by AT command “AT+CPOF”. NOTE 1. If the temperature is outside the range of -30℃~+70℃, some warning will be reported via AT port. If the temperature is outside the range of -40℃~+85℃, module will be powered off automatically.
SIM8300G-M2 Hardware Design V1.01 3.3 Reset Function SIM8300G-M2 can be reset by driving the RESET# pin down to a low level. The RESET# signal has been internally pulled up to 1.8V, so it does not need pull up externally. Please refer to the following figure for the recommended reference circuit. Figure 10: Reference reset circuit Table 12: Definition of RESET# pin Pin name RESET# Pin no.
SIM8300G-M2 Hardware Design V1.01 Table 13: RESET# pin electrical characteristics Symbol Description Min. Typ. Max. Unit Treset Low level hold time on RESET# pin 200 - 600 ms VIH Input high level voltage 1.2 - 1.9 V VIL Input low level voltage 0 - 0.4 V NOTE Please ensure that there is no capacitance on RESET# pin. www.simcom.
SIM8300G-M2 Hardware Design V1.01 3.4 I2C Interface SIM8300G-M2 supports an I2C interface meet I2C specification version 5.0, with data rate up to 400kbps. The following figure shows the I2C interface reference circuit. Figure 12: I2C reference circuit Table 14: Definition of I2C interface Electrical description description Comment 68 DIO I2C data signal 38 DO I2C clock signal 1.8V voltage domain, Internal pulled up to 1.8V. If unused, please keep open Pin name Pin no. I2C_SDA I2C_SCL www.
SIM8300G-M2 Hardware Design V1.01 3.5 WoWWAN#* The WoWWAN# pin is a system wake-on signal which can be used as an interrupt signal for the host. Normally it keeps high level. And it will change to low level when certain conditions occur, such as receiving SMS, voice call (CSD, video) or URC reporting, the low level pulse time is 1 second. Figure 13: WoWWAN# signal level at SMS and URC report WoWWAN# recommended reference circuit is shown in the following figure.
SIM8300G-M2 Hardware Design V1.01 3.6 USB Interface SIM8300G-M2 supports one USB interface which complies with the USB3.1 and 2.0 specifications. Customers can choose USB3.1 or USB2.0 for their needs. USB 3.1 data rate up to 10Gbps. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, firmware upgrade and software debugging. The module supports USB suspend and resume mechanism which can save power consumption.
SIM8300G-M2 Hardware Design V1.01 Table 16: Definition of USB interface Pin name Pin no. Electrical description USB_D+ 7 AIO USB_D- 9 AIO USB3.1_Tx- 29 AO USB3.1_Tx+ 31 AO USB3.1_Rx- 35 AI USB3.1_Rx+ 37 AI description Comment Differential USB bi-directional data positive Differential USB bi-directional data negative USB3.1 transmit data negative USB3.1 transmit data positive USB3.1 data rate up to 10Gbps USB2.0 data rate up to 480Mbps USB3.1 receive data negative USB3.
SIM8300G-M2 Hardware Design V1.01 3.7 PCIe Interface SIM8300G-M2 supports PCIe Gen3 one lane interfaces, which data rate up to 8Gbps, and can be used as EP or RC* mode. CLKREQ# and PEWAKE# needs pull up to 3.3V by 100K resesitor in customer’s design. The following figure is the PCIe reference circuit. Figure 16: PCIe interface reference circuit (EP Mode) NOTE 1. “*” means under development. 2. The AC capacitors of AP_PETn0 and AP_PETp0 should be closed to AP. 3.
SIM8300G-M2 Hardware Design V1.01 Table 18: Definition of PCIe interface Pin name Pin no.
SIM8300G-M2 Hardware Design V1.01 3.8 (U)SIM Interface SIM8300G-M2 supports (U)SIM1 cards and e-(U)SIM(internal of the module) card, the size is 2mm*2mm*1mm of the e-(U)SIM . Both (U)SIM 1 and e-(U)SIM are dual-voltage 1.8V or 3.0V. NOTE Customers choose the e-(U)SIM products according to the above size, SIMCom will provide the e-(U)SIM assemble into the module. Table 20: (U)SIM electrical characteristics in 1.8V mode ((U)SIM_PWR=1.8V) Symbol Parameter Min. Typ. Max.
SIM8300G-M2 Hardware Design V1.01 Figure 17: (U)SIM interface reference circuit When the (U)SIM card is inserted, the (U)SIM_DET will change from high to low level. The falling edge will indicate insertion of the (U)SIM card. When the (U)SIM card is removed, the (U)SIM_DET will change from low to high level. This rising edge will indicate unplug the (U)SIM card. The SIM card hot swap function needs to be enabled by AT.
SIM8300G-M2 Hardware Design V1.01 The (U)SIM card layout guidelines: Make sure that the (U)SIM card holder should be far away from the antenna while in PCB layout. (U)SIM traces should keep away from RF lines, VBAT and high-speed signal lines. The traces should be as short as possible. Keep (U)SIM holder’s GND connect to main ground directly. Shielding the (U)SIM card signal by ground. Recommended to place a 33pF～1uF capacitor on (U)SIM_PWR line and keep close to the holder.
SIM8300G-M2 Hardware Design V1.01 Figure 18: I2S timing Table 25: I2S timing parameters Signal I2S_MCLK I2S_CLK Parameter Description Min. Typ. Max. Unit Frequency Working Frequency – 12.288 12.288 MHz T Clock period 81.380 81.380 – ns t(HC) Clock high 0.45T – 0.55T ns t(LC) Clock low 0.45T – 0.55T ns Frequency Working Frequency 8 48 48 KHz T Clock period 20.83 20.83 125 us t(HC) Clock high 0.45T – 0.55T ns t(LC) Clock low 0.45T – 0.
SIM8300G-M2 Hardware Design V1.01 3.9.2 I2S Reference Circuit The following figure is the external codec reference design circuit. Figure 19: Audio codec diagram circuit Table 26: Definition of I2S interface Electrical description Description Comment 20 DO I2S clock output I2S_RX 22 DI I2S data input I2S_TX 24 DO I2S data output I2S_WA 28 DO I2S word alignment select (L/R) I2S_MCLK 60 DO I2S master clock 1.
SIM8300G-M2 Hardware Design V1.01 Audio layout guidelines: Analog input 0.2mm trace widths; 0.2mm spacing between other signals trace. Pseudo differential route for MIC. Isolate from noise sources, such as antenna, RF signals, SMPS, clocks, and other high speed signals. Analog output Isolate from noise sources such as antenna, RF signals, SMPS, clocks, and other high speed signals. Speaker output signal – route as differential pair with 0.5mm trace widths.
SIM8300G-M2 Hardware Design V1.01 3.10 DPR* DPR (Dynamic Power Reduction) signal is used for SAR (Specific Absorption Rate) requirements. The RF output power would reduce if this signal is triggered by sensor under some certain conditions, such as SAR sensor triggered, defined by customers. User can activate this function with AT command. Table 28: Definition of DPR# pin Pin no.
SIM8300G-M2 Hardware Design V1.01 3.11 CONFIG Pins These signals are provided to indicate its specific configuration that is WWAN-USB3.1 of SIM8300G-M2. Table 29: CONFIG pins state of the module Pin no. Pin name Description 21 CONFIG_0 Connected to ground internally 69 CONFIG_1 Connected to ground internally 75 CONFIG_2 Connected to ground internally 1 CONFIG_3 Not connected In the M.2 specifications, the CONFIG pins are defined as below.
SIM8300G-M2 Hardware Design V1.01 Table 31: Definition of LED1# pin Pin Name Pin No. Electrical Description LED1# 10 OD Description Comments The module status indicator via LED devices Active low NOTE 1. “*” means under development. 2. The value of the resistor R1 depends on the LED characteristics. The timing parameters are shown in the following table.
SIM8300G-M2 Hardware Design V1.01 3.13 W_DISABLE1# The W_DISABLE1# pin controls SIM8300G-M2 to enter the flight mode. When the W_DISABLE1# signal is pulled to low level, RF function would be disabled. Otherwise the RF function would be active. Recommended reference circuit is shown in the following figure. Figure 21: W_DISABLE1# pin reference circuit Table 33: Definition of W_DISABLE1# pin Pin Name W_DISABLE1# Pin No. 8 Electrical Description Description Comments DI WWAN RF disable Active low 3.
SIM8300G-M2 Hardware Design V1.01 3.14 W_DISABLE2#* The W_DISABLE2# pin controls SIM8300G-M2 to disable the GNSS function. When the W_DISABLE2# signal is pulled to low level, the GNSS function would be disabled. Recommended reference circuit is shown in the following figure. Figure 22: W_DISABLE2# pin reference circuit Table 35: Definition of W_DISABLE2# pin Pin Name W_DISABLE2# Pin No. 26 Electrical Description Description Comments DI GNSS disable Active low 3.
SIM8300G-M2 Hardware Design V1.01 3.15 Antenna Control Interface* ANTCTL[0:3] and RFFE signals are used for tunable antenna control and should be routed to an appropriate antenna control circuitry. The following table is the definitions for antenna control interfaces. Table 37: Definition of antenna control interface through GPIOs Pin Name Pin No.
SIM8300G-M2 Hardware Design V1.01 4. Antenna Interfaces SIM8300G-M2 provides four antenna interfaces, and all of them should be 50Ω impedance controlled for RF signal. 4.1 Antenna Definitions Antenna interfaces are shown in the following figure. Figure 23: Antenna interfaces Table 38: Antenna port definitions ANT item ANT function Frequency Range Functional description ANT0 GNSS 5G n79 DIV 1166MHz~1610MHz 4400 MHz – 5000 MHz 5G n79/GNSS signal receive www.simcom.
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SIM8300G-M2 Hardware Design V1.01 4.1.
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SIM8300G-M2 Hardware Design V1.01 4.2 Antenna Installation 4.2.1 Antenna Requirements The following table shows the requirements on 3G/4G/5G antennas and GNSS antenna. Table 42: 3G/4G/5G/GNSS antennas Parameter Requirement Operating Frequency See Table 38 for each antenna Direction Omni Directional Gain > -3dBi (Avg) Impedance 50 Ω Efficiency > 50 % Max. Input Power 50W VSWR <2 Isolation 20dB is preferred Cable Insertion Loss <1GHz <1dB Cable Insertion Loss 1GHz~2.2GHz <1.
SIM8300G-M2 Hardware Design V1.01 NOTE “*” means these recommendations are for dedicated GNSS antenna which the application need best of class GNSS tracking performance. 4.2.2 RF Plug Recommendation SIM8300G-M2 is mounted with Murata’s receptacle RF connectors MM4829-2702B/RA4/RB0, which size is 2.0mm*2.0mm*0.6mm. The connector dimensions are shown as below. Figure 24: 3D view of MM4829-2702B/ RA4/ RBO The following table shows the RF connector’s electrical specifications.
SIM8300G-M2 Hardware Design V1.01 Voltage Standing Wave Ratio (V.S.W.R.) Meet the requirements of 1.3max.(DC∼3GHz) 1.45max.(3GHz∼6GHz) To get best RF performance, the RF plug connector should be designed to match the receptacle MM4829-2702B/RA4/RB0, and the parts come from Murata is the recommended. The following is the mechanical information of the Murata's RF coaxial cable MXHJD3HJ1000 for reference. For further technical support, the customer could visit the Murata’s website (www.murata.
SIM8300G-M2 Hardware Design V1.01 4.3 mmWave Antenna Installation The QTM527 is an LGA based millimeter-wave module that includes an integrated RFIC with power management IC and phased antenna array. QTM527 (*4) modules are used for HP CPE applications. The QTM525 millimeter-wave module includes an integrated RFIC, power management IC, and phased antenna array supporting 5G NR. 4.3.
SIM8300G-M2 Hardware Design V1.01 Figure 27: SIM8300G to QTM527 IF connections 4.3.2 IF Plug Recommendation SIM8300G-M2 is mounted with I-PEX’s high shielding performance RF connectors MHF 7S for mmWave. The connector dimensions are shown as below. Figure 28: IF connections MHF 7S for mmWave www.simcom.
SIM8300G-M2 Hardware Design V1.01 Figure 29: 3D view of 20956-001E-01 Table 45: Electrical Specifications of 20956-001E-01 Item Specification Applicable connector part no. 20955-001R-13 Rating voltage 60 V AC (R.M.S)/DC Rating frequency DC～15 GHz Operating temperature 233～363 K (-40℃～+90℃) Operating humidity 90% MAX. (NON-CONDENSING) Characteristic impedance 50Ω Main contact resistance Initial: 20 mohm MAX./ After test: ⊿R 20 mohm MAX Ground contact resistance Initial: 20 mohm MAX.
SIM8300G-M2 Hardware Design V1.01 Figure 30: 3D view of 20955-001R-13 www.simcom.
SIM8300G-M2 Hardware Design V1.01 5. Electrical Specifications 5.1 Absolute Maximum Ratings Absolute maximum rating for digital and analog pins of module are listed in the following table. Table 46: Absolute maximum ratings Parameter Min. Typ. Max. Unit Voltage at VBAT pins - - 4.8 V Voltage at digital pins (GPIO,I2C,UART, I2S) - - 2.1 V Voltage at digital pins ((U)SIM) - - 3.05 V Voltage at FULL_CARD_POWER_OFF# - - 4.4 V Voltage at RESET# - - 1.9 V Parameter Min. Typ.
SIM8300G-M2 Hardware Design V1.01 IIH Input high leakage current (no pull down resistor) - 1 uA IIL Input low leakage current(no pull -1 up resistor) - - uA Table 49: Operating temperature Parameter Min. Typ. Max. Unit Normal operation temperature(3GPP compliant) -30 - 70 ℃ Extended operation temperature* -40 - 85 ℃ Storage temperature -40 - 90 ℃ 5.3 Operating Mode 5.3.1 Operating Mode Definition The table below summarizes the various operating modes of SIM8300G-M2.
SIM8300G-M2 Hardware Design V1.01 be used to set the module to flight mode without removing the power supply. In this case, the RF part of the module will not work, but the serial port and USB are still available. The power consumption is lower than normal mode. Power off Normally module will go into power off mode by sending the AT command “AT+CPOF” or pull down the FULL_CARD_POWER_OFF# pin. In this mode the power management unit shuts down the power supply, and software is not active.
SIM8300G-M2 Hardware Design V1.01 5.4 Current Consumption The current consumptions are listed in the table below. Table 51: Current consumption on VBAT pins (VBAT=3.
SIM8300G-M2 Hardware Design V1.01 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 LTE-FDD B30 LTE-FDD B66 LTE-FDD B71 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40 LTE-TDD B41 LTE-TDD B42 LTE-TDD B48 5G NR data 5G n1 www.simcom.
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SIM8300G-M2 Hardware Design V1.01 5.6 Conducted Receive Sensitivity The conducted RF receiving sensitivity is shown in the following table. Table 53: Conducted RF receiving sensitivity Frequency Primary (Typ.) Diversity (Typ.) MIMO1 (Typ.) MIMO2 (TYP.) 3GPP TBD -106.7dBm WCDMA B2 TBD TBD TBD TBD -103.7dBm WCDMA B3 TBD TBD TBD TBD -104.7dBm WCDMA B4 TBD TBD TBD TBD -103.7dBm WCDMA B5 TBD TBD TBD TBD -96.3dBm WCDMA B8 TBD TBD TBD TBD -93.
SIM8300G-M2 Hardware Design V1.01 LTE B42 TBD TBD TBD TBD -95.0dBm@10MHz LTE B48 TBD TBD TBD TBD -95.3dBm@10MHz LTE B66 TBD TBD TBD TBD -95.8dBm@10MHz LTE B71 TBD TBD TBD TBD -93.5dBm@10MHz 5G n1 TBD TBD TBD TBD -94.0dBm@30KHz@20MHz 5G n2 TBD TBD TBD TBD -92.0dBm@30KHz@20MHz 5G n3 TBD TBD TBD TBD -91.0dBm@30KHz@20MHz 5G n5 TBD TBD TBD TBD -91.0dBm@30KHz@20MHz 5G n7 TBD TBD TBD TBD -92.0dBm@30KHz@20MHz 5G n8 TBD TBD TBD TBD -90.
SIM8300G-M2 Hardware Design V1.01 5.7 Thermal Design Make sure that the SIM8300G-M2 can reach maximum work performance under extended temperature or extreme conditions for a long time, thermal dissipation design is very important. It is strongly recommended to add a thermal pad on the customer’s main PCB, add thermally conductive material on top of the module as well as between the module and the main PCB.
SIM8300G-M2 Hardware Design V1.01 5.8 ESD* SIM8300G-M2 is sensitive to ESD in the process of storage, transporting, and assembling. When module is mounted on the customer’s main board, the ESD components should be placed closed to the connectors which human body may touch, such as (U)SIM card holder, audio jacks, switches, USB interface, etc. The following table shows the module ESD test performance.
SIM8300G-M2 Hardware Design V1.01 6. Appearance 6.1 Top and Bottom View of SIM8300G-M2 Figure 32: Top and bottom view of the module 6.2 Label Description Information T Figure 33: Label description of the module Table 55: Label description of the module information www.simcom.
SIM8300G-M2 Hardware Design V1.01 No. Description A LOGO B Project name C Product code D QR code E Serial number F International mobile equipment identity NOTE Figure 32 and Figure 33 are the effect diagrams of the module, for reference only. The outward appearance please subject to the actual product. www.simcom.
SIM8300G-M2 Hardware Design V1.01 7. Packaging SIM8300G-M2 supports tray packaging. The packaging procedures are shown in the following figure. Figure 34: Packaging procedures Figure 35: Tray view of the module www.simcom.
SIM8300G-M2 Hardware Design V1.01 Table 56: Tray size Length（±3mm） Width（±3mm） Number 161.0 10 242.0 Figure 36: Small carton view Table 57: Small carton size Length（±10mm） Width（±10mm） Height（±10mm） Number 270 180 120 10*15=150 Figure 37: Big carton view www.simcom.
SIM8300G-M2 Hardware Design V1.01 Table 58: Big carton size Length（±10mm） Width（±10mm） Height（±10mm） Number 380 280 280 150*4=600 www.simcom.
SIM8300G-M2 Hardware Design V1.01 8. Appendix 8.1 Coding Schemes and Maximum Net Data Rates over Air Interface Table 59: Coding schemes and maximum net data rates over air interface HSDPA device category Max data rate（peak） Modulation type Category 1 1.2Mbps 16QAM,QPSK Category 2 1.2Mbps 16QAM,QPSK Category 3 1.8Mbps 16QAM,QPSK Category 4 1.8Mbps 16QAM,QPSK Category 5 3.6Mbps 16QAM,QPSK Category 6 3.6Mbps 16QAM,QPSK Category 7 7.2Mbps 16QAM,QPSK Category 8 7.
SIM8300G-M2 Hardware Design V1.01 Category 6 5.
SIM8300G-M2 Hardware Design V1.01 8.2 Related Documents Table 60: Related documents No. [1] [2] Title SIM8200 Series_AT Command Manual ITU-T Draft new recommendationV.25ter Description AT Command Manual Serial asynchronous automatic dialing and control [3] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification [4] 3GPP TS 38.401 NG-RAN; Architecture description [5] 3GPP TS 34.124 [6] 3GPP TS 34.121 [7] 3GPP TS 34.
SIM8300G-M2 Hardware Design V1.01 8.
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SIM8300G-M2 Hardware Design V1.01 8.4 Safety Caution Table 62: Safety caution Marks Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off.
