Hardware Design
Table Of Contents
- Contents
- Table Index
- Revision History
- 1 Introduction
- 2 Package Information
- 3 Interface Application
- 4 Antenna Interfaces
- 5 Electrical Specifications
- 6 Top and Bottom View of Module
- 7 Label description Information
- 8 Packaging
- Appendix
Smart Machine Smart Decision
SIM8200EA-M2 card Hardware Design _V1.01 11 2019-06-27
USB
One USB 3.1 SuperSpeed and high-speed (for backward
compatibility)
USB3.1: super speed, with data rate which is up to 10 Gbps.
USB2.0: high speed interface, support USB operations at low-speed
and full-speed, which refer to USB1.0 and USB1.1.
Firmware upgrade Firmware upgrade over USB interface or FOTA
Physical characteristics
Size: 30*52*2.3mm
Weight: TBD
Temperature range
Normal operation temperature: -30°C to +75°C
Extended operation temperature: -40°C to +85°C*
Storage temperature -45°C to +90°C
*Note: Module is able to make and receive voice calls, data calls, SMS and make
GPRS/UMTS/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly
from the 3GPP specifications if the temperature is outside the normal operating temperature
range and still within the extended operating temperature range.
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