Hardware+Design V1.07

Smart Machine Smart Decision
For details about secondary SMT, please refer to document [26].
6.3 Moisture Sensitivity Level (MSL)
SIM5320 is qualified to Moisture Sensitivity Level (MSL) 5 in accordance with JEDEC J-STD-020. After
the prescribed time limit exceeded, users should bake modules for 192 hours in drying equipment (<5%
RH) at 40° C +5° C/-0° C, or 72 hours at 85° C +5° C/-5° C. Note that plastic tray is not heat-resistant,
users must not use the tray to bake at 85° C or the tray may be damaged.
6.4 Stencil Foil Design Recommendation
The recommended thickness of stencil foil is more than 0.15mm.
6.5 Recommended Pad Design
Figure 45: Recommended pad
Note: More designing details refer to Figure 6.
SIM5320_Hardware Design_V1.07 2012-09-21
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