Hardware+Design V1.07

Table Of Contents
Smart Machine Smart Decision
6 Guide for Production
6.1 Top and Bottom View of SIM5320
Figure 43: Top and bottom view of SIM5320
These test points are only used for module manufacturing and testing. They are not for customer’s
application.
6.2 Typical Solder Reflow Profile
For customer convenience, SIMCom provides a typical example for a commonly used soldering profile. In
final board assembly, the typical solder reflow profile will be determined by the largest component on the
board, as well as the type of solder/flux used and PCB stack-up. Therefore the soldering profile shown
below is only a generic recommendation and should be adjusted to the specific application and
manufacturing constraints.
Figure 44: The ramp-soak-spike reflow profile of SIM5320
SIM5320_Hardware Design_V1.07 2012-09-21
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